Light bulb shaped lamp and lighting apparatus

ABSTRACT

A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.

This application is a continuation of U.S. application Ser. No.13/882,204, filed on Apr. 29, 2013, which is a National PhaseApplication of International Application PCT/JP2011/006162 filed Nov. 4,2011, the contents of each of which are expressly incorporated byreference in their entireties.

TECHNICAL FIELD

The present invention relates to a light bulb shaped lamp having alight-emitting device such as a light-emitting diode (LED) and alighting apparatus which includes the light-emitting device.

BACKGROUND ART

Compared to conventional illumination light source, LEDs are small, havehigh efficiency and long product life. LEDs are considered as a newillumination light source for conventional lamps such as fluorescentlight and incandescent light bulb, and research and development havebeen done on a lamp using LED (LED lamp). Recent market needs for savingenergy and resource boost the demand for light bulb shaped lamps usingLEDs (hereafter simply referred to as “light bulb shaped LED lamp” or“LED light bulb”) replacing conventional incandescent light bulbs usingfilament coils, and lighting apparatuses including the LED light bulbs.

Known properties of LEDs include reduced light output as temperatureincreases, which lead to shorter product life. In response to thisproblem, a metal case is provided between a semispherical globe and abase in a conventional LED light bulb so as to suppress the increase inthe temperature of LED (for example, see Patent Literature 1).

The conventional light bulb shaped LED lamp disclosed in PatentLiterature 1 shall be described as follows with reference to FIG. 52.FIG. 52 is a cross-sectional view of a light bulb shaped LED lampaccording to the conventional art.

As illustrated in FIG. 52, the conventional LED lamp 1000 includes atranslucent cover 1110 which is a semispherical globe, a base 1190 forreceiving power, and an outer case 1200 which is a metal case.

The outer case 1200 includes a peripheral portion 1210 exposed tooutside, a circular-plate light-source attachment 1220 integrally formedwith the circumferential part 1210, and a recess 1230 formed inside ofthe circumferential portion 1210. On the upper surface of thelight-source attachment 1220, an LED module 1130 which includes LEDs ismounted on a base platform. Note that, an insulator 1240 formed alongthe shape of the inner surface of the recess 1230 is provided on theinner surface of the recess 1230, and a lighting circuit 1180 forturning on the LEDs are housed in the insulator 1240.

With the conventional light bulb shaped LED lamp 1000 having theconfiguration described above, the outer case 1200 (metal case) in whichthe light-source attachment 1220 and the peripheral portion 1210 areintegrally formed is used. The outer case 1200 functions as a heat sinkfor radiating heat generated at the LED to outside, and the heatgenerated at the LED is efficiently conducted from the light-sourceattachment 1220 to the peripheral portion 1210. With this, the increasein the temperature of the LED is suppressed, thereby preventingreduction of the light output from the LEDs.

CITATION LIST Patent Literature

-   [Patent Literature 1] Japanese Unexamined Patent Application    Publication No. 2006-313717

SUMMARY OF INVENTION Technical Problem

However, in the conventional light bulb shaped LED lamp disclosed inPatent Literature 1, the LED module 1130 is provided on the light-sourceattachment 1220 in the outer case (metal case) 1200. Consequently, thelight toward the base 1190 is blocked by the outer case 1200, and thelight is distributed differently from incandescent light bulbs. In otherwords, with the conventional light bulb shaped LED lamp, it is difficultto achieve the light-distribution property equivalent to incandescentlight bulbs.

Thus, changing the configuration of the light bulb shaped LED lamp tothe same configuration as the incandescent light bulbs is one possibleoption. For example, a configuration of such an LED light bulb includesan LED module replacing a filament coil installed between the two leadwires of an incandescent light bulb, which is held by the lead wire or aglass stem. In this case, the light emitted by the LED module is notblocked by the metal case. Accordingly, the light distribution propertyapproximated to that of incandescent light bulb can be achieved.

However, the LED module is heavier than the filament coil used inincandescent light bulbs. Accordingly, there is another problem thatmerely supporting the LED module with the two lead wires in the samemanner as the filament coil would not likely to keep the LED moduleremaining at a constant position in the globe. In addition, there isanother problem that the lead wires may be disconnected from the LEDmodule due to stress exerted on a part connecting the lead wire and theLED module caused by vibration or others at the time of transportation.

Furthermore, in the light bulb shaped LED lamp having the structuredescribed above, the LED module suspended in the globe is connected onlyto the lead wire. Consequently, there is a problem that the heatgenerated by the LED is not sufficiently dissipated.

Furthermore, in the light bulb shaped lamp having the configurationdescribed above, it is difficult to position the components, and it isnot easy to assemble the lamp as a result. For example, in order to fixthe LED module at the top of the glass stem, it is difficult to positionthe LED module and the glass stem properly. Furthermore, the lead wirefor supplying power is connected to the LED module. However, it isdifficult to position the LED module and the lead wire properly. Inparticular, it is necessary to supply DC voltage to the LED module, andvoltage must be applied to two power supply terminals of the LED modulewith the negative voltage and positive voltage distinguished. Stateddifferently, it is necessary to distinguish the two lead wires between alead wire on the positive voltage side and a lead wire on the negativevoltage side, and to connect the lead wires to the power supplyterminals of the LED module associated with one another. This makes thework for connecting the lead wire to the LED module more complex. Asdescribed above, in an attempt to construct a light bulb shaped LED lamphaving light distribution property approximated to an incandescent lightbulb, there is a problem that the lamp cannot be easily assembled.

The present invention has been conceived in order to solve the problem,and it is the first object of the present invention to provide a lightbulb shaped lamp capable of achieving light distribution propertyequivalent to conventional incandescent light bulbs and firmly fixingand holding a base platform on which a light-emitting device is mounted,and a lighting apparatus including the light bulb shaped lamp.

It is the second object of the present invention to provide a light bulbshaped lamp capable of achieving light distribution property equivalentto conventional incandescent light bulbs and suppressing possibility ofa lead wire being disconnected from a light-emitting module and alighting apparatus including the light bulb shaped lamp.

It is the third object of the present invention to provide a light bulbshaped lamp capable of having a structure as conventional incandescentlight bulbs and efficiently dissipating heat generated at thelight-emitting device.

It is the fourth object of the present invention to provide a light bulbshaped lamp that can be easily assembled and a lighting apparatus.

Solution to Problem

In order to achieve the first object, the light bulb shaped lampaccording to an aspect of the present invention includes a light bulbshaped lamp including: a hollow globe; a light-emitting module includinga base platform and a light-emitting device mounted on the baseplatform, the light-emitting module being provided in the globe; a leadwire for supplying power to the light-emitting module; and a stemextending toward the interior of the globe, in which the light-emittingmodule is directly fixed to the stem.

According to this configuration, the light-emitting module is directlyfixed to the stem, and thus it is possible to fix and hold thelight-emitting module firmly, compared to a case in which the baseplatform is supported only by the lead wires, for example. Furthermore,light emitted by the light-emitting device is not blocked by the base.Accordingly, it is possible to achieve the light distribution propertyequivalent to conventional incandescent light bulbs.

Furthermore, according to this configuration, it is possible to transferthe heat generated at the light-emitting device to the globe, the base,or others through the stem, and to suppress the increase in thetemperature of the light-emitting device. Furthermore, the stem forfixing the base platform is a component commonly used in incandescentlight bulbs. Accordingly, it is possible to reduce the difference fromincandescent light bulbs in terms of appearance.

Furthermore, in order to achieve the first object, it is preferable thatthe base platform is directly fixed to the stem.

According to this configuration, it is possible to fix the base platformon which the light-emitting device is mounted directly to the stem, andthus the base platform is fixed and held firmly.

Furthermore, in order to achieve the first object, it is preferable thatthe base platform is fixed to the stem by an adhesive material.

According to this configuration, the base platform is fixed to the stemby the adhesive material, and thus the base platform can be fixed andheld more firmly.

Furthermore, in order to achieve the first object, it is preferable thatthe adhesive material is transparent to visible light.

According to this configuration, the adhesive material is transparent tovisible light, and thus it is possible to suppress the loss of lightemitted by the light-emitting device by the adhesive material.Furthermore, it is possible to prevent a shadow cast by the adhesivematerial.

Furthermore, in order to achieve the first object, it is preferable thatthe adhesive material is made of silicone resin.

With this configuration, it is possible to use silicone resin as theadhesive material.

Furthermore, in order to achieve the first object, it is preferable thatthe base platform has a shape of a prism, the light-emitting device ismounted on at least one side of the base platform, and a side of thebase platform is fixed to an end of the stem.

According to this configuration, it is possible to fix a side surface ofthe base in the prism shape to the end of the stem. Accordingly, it ispossible to fix and hold the base platform more firmly than a case wherethe base platform is supported only by the lead wires. Furthermore,since the base platform is in the prism shape, it is possible toreproduce a filament coil of an incandescent light bulb by alight-emitting device and a base platform in a simulative manner.

Furthermore, in order to achieve the first object, it is preferable thatthe base platform has a shape of board, the light-emitting device ismounted on at least one surface of the base platform, and the othersurface of the base platform is fixed to an end of the stem.

According to this configuration, it is possible to fix a side surface ofthe board-shaped base platform to the end of the stem. Accordingly, itis possible to fix and hold the base platform more firmly than a casewhere the base platform is supported only by the lead wires.

Furthermore, in order to achieve the first object, it is preferable thatthe base platform is translucent.

According to this configuration, the base platform is translucent.Accordingly, the light emitted by the light-emitting device passesthrough the inside of the base platform, and the light is emitted from apart where no light-emitting device is mounted. Accordingly, even whenthe light-emitting device is mounted only on one side of the baseplatform, light is emitted from the other side, which makes the lightbulb shaped lamp possible to achieve the light distribution propertyequivalent to the incandescent light bulb.

Furthermore, in order to achieve the first object, it is preferable thatthe stem is transparent to visible light.

According to this configuration, the stem is transparent to visiblelight, and thus it is possible to suppress the loss of light emitted bythe stem. Furthermore, it is possible to prevent the shadow cast by thestem. Furthermore, light emitted by the light-emitting device lights upthe stem. Thus, the light bulb shaped lamp can achieve visually superiorappearance.

Furthermore, in order to achieve the first object, it is preferable thatthe stem is joined with the globe so as to close an opening of theglobe, and a part of the lead wire is sealed in the stem.

With this configuration, the opening of the globe is closed by the stem.Accordingly, it is possible to prevent moisture from entering the globefrom outside, and suppress the degradation of the light-emitting deviceby moisture.

In order to achieve the second object, in the light bulb shaped lampaccording to an aspect of the present invention, it is preferable thatthe light-emitting module includes a plurality of the base platforms anda fixing component for attaching the base platforms, and the fixingcomponent is directly fixed to the stem.

With this configuration, the fixing component attached to the baseplatform may be directly fixed to the stem. Accordingly, it is possibleto fix and hold the base platform to the stem through the fixingcomponent.

Furthermore, in order to achieve the second object, it is preferablethat a first through hole is formed in the fixing component, and an endportion of the stem is inserted into the first through hole.

With this configuration, the stem inserted into the first through holedefined by the fixing component can support the fixing component towhich the base platforms are fixed in the globe. Accordingly, when thelight bulb shaped lamp is shaken, for example, it is possible tosuppress the stress exerted on the part connecting the lead wire and thelight-emitting module, and to suppress the possibility that the leadwire is disconnected from the light-emitting module. Furthermore, lightemitted by the light-emitting device is not blocked by the base.Accordingly, it is possible to achieve the light distribution propertyequivalent to conventional incandescent light bulbs.

Furthermore, in order to achieve the second object, it is preferablethat a stepped part is formed at the end portion of the stem, and thefixing component is supported by the stepped part formed at the endportion of the stem.

With this configuration, the fixing component is supported by thestepped part formed at the end portion of the stem, and thus it ispossible to regulate the movement of the fixing component toward thestem. Accordingly, it is possible to suppress the possibility that thelead wire is disconnected from the light-emitting module even moresecurely.

Furthermore, in order to achieve the second object, it is preferablethat the end portion of the stem is fit into the first through hole.

According to this configuration, the end portion of the stem is fit intothe first through hole, and thus it is possible to fix the fixingcomponent to the stem. Accordingly, it is possible to suppress thepossibility that the lead wire is disconnected from the light-emittingmodule even more securely.

Furthermore, in order to achieve the second object, it is preferablethat the base platforms are fixed to the fixing component such that abarycenter of the fixing component and the base platforms coincides witha center position of the first through hole when viewed in a longerdirection of the stem.

With this configuration, the barycenter of the fixing component and thebase platforms coincides with the center of the first through hole, andthus it is possible to stably support the fixing component and the baseplatforms.

Furthermore, in order to achieve the second object, it is preferablethat the fixing component is fixed to an end portion of the stem by anadhesive material.

With this configuration, the fixing component is fixed to the endportion of the stem by the adhesive material. Accordingly, it ispossible to regulate the movement of the fixing component even moresecurely. Accordingly, it is possible to suppress the possibility thatthe lead wire is disconnected from the light-emitting module even moresecurely.

Furthermore, in order to achieve the second object, it is preferablethat a third through hole is formed in the base platform, and the leadwire is inserted into the third through hole and supports the baseplatform.

With this configuration, the lead wire is inserted into the thirdthrough hole in the base platform. Accordingly, it is possible todisperse the stress exerted on the part connecting the lead wire and thelight-emitting module due to vibration or others. Accordingly, it ispossible to suppress the possibility that the lead wires aredisconnected from the light-emitting module due to vibration or others.

Furthermore, in order to achieve the second object, it is preferablethat a fourth through hole is formed in the base platform, a secondthrough hole is formed in the fixing component so as to communicate withthe fourth through hole, and the lead wire is inserted into the secondthrough hole and the fourth through hole.

According to this configuration, the lead wires are inserted through thesecond through hole and the fourth through hole penetrating the fixingcomponent and the base platform. Accordingly, it is possible to fix thefixing component and the base platform firmly.

Furthermore, in order to achieve the second object, it is preferablethat a conductive rivet is provided at an end of the lead wire, and thebase platform is fixed to the fixing component by the rivet insertedinto the second through hole and the fourth through hole.

According to this configuration, the fixing component and the baseplatform are fixed by the rivet formed at the end of the lead wire, andthus the fixing component and the base platform are fixed even morefirmly.

Furthermore, in order to achieve the second object, it is preferablethat a line pattern is formed on the fixing component, and thelight-emitting devices each mounted on one of the base platforms areelectrically connected through the line pattern.

According to this configuration, the light-emitting devices in the baseplatforms by a line pattern formed on the fixing component, thus thelight-emitting devices are electrically connected easily in the globe.

Furthermore, in order to achieve the second object, it is preferablethat the stem is joined with the globe so as to close an opening of theglobe, and a part of the lead wire is sealed in the stem.

According to this configuration, the stem closes the opening of theglobe, and thus it is possible to prevent the moisture from entering theglobe from outside of the globe, and to suppress the degradation of thelight-emitting device and at the part connecting the light-emittingmodule and the lead wire due to moisture. Accordingly, it is possible tosuppress the possibility that the lead wires are disconnected from thelight-emitting module due to vibration or others more securely.

Furthermore, in order to achieve the second object, it is preferablethat the fixing component is transparent to visible light.

According to this configuration, the fixing component is transparent tovisible light, and thus it is possible to suppress the loss of lightemitted by the light-emitting device. Furthermore, it is possible toprevent a shadow cast by the fixing component.

Furthermore, in order to achieve the second object, it is preferablethat the base platform is translucent.

With this configuration, the base platform is translucent. Accordingly,the light emitted by the light-emitting device pass through the interiorof the base platform. To put it differently, the light is emitted from apart of the base platform where the light-emitting device is notmounted. Accordingly, even when the light-emitting device is mountedonly on one side of the base platform, light is emitted from the otherside, which makes the light bulb shaped lamp possible to achieve thelight distribution property equivalent to the incandescent light bulb.

Furthermore, in order to achieve the second object, it is preferablethat the stem is transparent to visible light.

According to this configuration, the stem is transparent to visiblelight, and thus it is possible to suppress the loss of light emitted bythe light-emitting device caused by the stem. Furthermore, it ispossible to prevent the shadow cast by the stem. Furthermore, lightemitted by the light-emitting device lights up the stem 120. Thus, thelight bulb shaped lamp can achieve visually superior appearance.

In order to achieve the third object, in the light bulb shaped lampaccording to an aspect of the present invention, it is preferable thatthe stem is made of a material having a thermal conductivity higher thana thermal conductivity of the base platform.

With this configuration, the light-emitting module is arranged in thehollow globe, and thus it is possible to achieve the light distributionproperty equivalent to that of incandescent light bulb. Furthermore, thebase platform of the light-emitting module is connected to the stemcomposed of the material having a thermal conductivity higher than thethermal conductivity of the base platform, and thus the heat generatedat the light-emitting module can be conducted to the stem efficiently.With this, it is possible to sufficiently dissipate the heat at thelight-emitting module.

Furthermore, in order to achieve the third object, it is preferable thata supporting component which is connected to an opening end of anopening of the globe and supports the stem is included, in which thesupporting component is made of a material having a thermal conductivityhigher than a thermal conductivity of the base platform.

According to this configuration, the stem is supported by the supportingcomponent made of a material having a thermal conductivity higher thanthe thermal conductivity of the base platform, and thus the heat at thelight-emitting module conducted to the stem is efficiently conducted tothe supporting component. Furthermore, the supporting component isconnected to the globe, and thus the heat conducted to the supportingcomponent can be dissipated to the air from the surface of the globe.With this, the heat generated at the light-emitting module can bedissipated in the air efficiently.

Furthermore, in order to achieve the third object, it is preferable thatthe supporting component is made of a material having a thermalconductivity higher than or equal to the thermal conductivity of thestem.

According to this configuration, the heat at the light-emitting moduleconducted to the stem is efficiently conducted to the supportingcomponent.

Furthermore, in order to achieve the third object, it is preferable thatthe stem and the supporting component are made of metal.

Furthermore, in order to achieve the third object, it is preferable thatthe stem and the supporting component are made of aluminum.

Furthermore, in order to achieve the third object, it is preferable thatthe globe is composed of glass transparent to visible light.

With this configuration, the globe is transparent to visible light.Accordingly, it is possible to suppress the loss of light emitted by thesemiconductor light-emitting device. Furthermore, since the globe ismade of glass, it is possible to achieve high resistance to heat.

Furthermore, in order to achieve the third object, it is preferable thatthe base platform and the stem are fixed by a screw.

With this configuration, the base platform and the stem are firmlysupported and fixed. In addition, the heat dissipating property of thelight-emitting module can be further improved.

In order to achieve the fourth object, in an aspect of the light bulbshaped lamp according to the present invention, it is preferable thatthe stem includes a first engaging part which suppresses rotationalmovement of the light-emitting module having an axis in the extendingdirection of the stem, and the base platform includes a second engagingpart which engages with the first engaging part.

According to this configuration, the first engaging part and the secondengaging part suppress the movement of the light-emitting module, andthus it is possibly to position the light-emitting module and the stemeasily. Furthermore, the light-emitting module is arranged in the hollowglobe, and thus it is possible to achieve the light distributionproperty equivalent to that of incandescent light bulb.

Furthermore, in order to achieve the fourth object, the first engagingpart can be a projection formed at a top of the stem, and the secondengaging part can be a through hole or a recess fit into the projection.In this case, the projection can have a shape of rectangle in top view.

Furthermore, in order to achieve the fourth object, it is preferablethat the projection has a shape in top view that determines a posture ofthe light-emitting module to be a predetermined posture.

According to this configuration, the light-emitting module is set to bein one posture, and thus it is possible to determine the position forarranging the light-emitting module with respect to the stem uniquely ineither of the two axial directions orthogonal to each other, that is,the vertical direction or the horizontal direction in top view of thelight-emitting module.

Furthermore, in order to achieve the fourth object, it is preferablethat the first engaging part is a plurality of projections formed at atop of the stem, and the second engaging part is (i) one through hole orrecess that engages with the projections or (ii) a plurality of throughholes or recesses each corresponding to one of the projections.

By providing a plurality of projections as described above, even if theprojection is in a shape in top view that does not determine theposition for arranging the light-emitting module in one axial direction,that is, in a circular shape or a polygonal shape, the position in therotation direction of the light-emitting module can be uniquelydetermined.

Furthermore, in order to achieve the fourth object, it is preferablethat the projections include a first projection and a second projectionhaving different shapes in top view.

According to this configuration, even if the projection is in a shapethat does not determine the direction of the position for arranging thelight-emitting module in one axial direction such as circular shape orregular polygonal shape in top view, the light-emitting module can beset in one predetermined posture, and thus the position for arrangingthe light-emitting module with respect to the stem can be uniquelydetermined in either of the two axial directions orthogonal to eachother, that is, the vertical direction and the horizontal direction.

Furthermore, in order to achieve the first to fourth objects, it ispreferable that the globe is made of glass transparent to visible light.

With this configuration, the globe is transparent to visible light.Accordingly, it is possible to suppress the loss of light emitted by thelight-emitting device. Furthermore, since the globe is made of glass, itis possible to achieve high resistance to heat.

Furthermore, in order to achieve the first to fourth objects, it ispreferable that a base which receives power for causing thelight-emitting device to emit light; and an insulating case whichinsulates at least the stem and the base, and houses a lighting circuitfor causing the light-emitting device to emit light are included.

With this configuration, the insulating case insulates the stem and thebase.

Furthermore, an aspect of the lighting apparatus according to thepresent invention includes the light bulb shaped lamp described above.

As described above, the present invention may be implemented as alighting apparatus including the light bulb shaped lamp described above.

Advantageous Effects of Invention

According to the present invention, it is possible to fix the baseplatform on which the light-emitting device is mounted directly to thestem, and thus the base platform is fixed and held firmly. Furthermore,light emitted by the light-emitting device is not blocked by the base.Accordingly, it is possible to achieve the light distribution propertyequivalent to conventional incandescent light bulbs.

Furthermore, according to the present invention including the firstthrough hole, the stem inserted into the first through hole defined bythe fixing component supports the fixing component on which thelight-emitting modules are fixed. Accordingly, when the light bulbshaped lamp is shaken, for example, it is possible to suppress thestress exerted on the part connecting the lead wire and thelight-emitting module, and to suppress the possibility that the leadwire is disconnected from the light-emitting module. Furthermore, lightemitted by the semiconductor light-emitting device is not blocked by thecase. Accordingly, it is possible to achieve the light distributionproperty equivalent to conventional incandescent light bulbs.

Furthermore, according to the present invention having a stem with alarger thermal conductivity, it is possible to configure the light bulbshaped lamp equivalent to conventional incandescent light bulbs and toefficiently dissipate the heat generated at the light-emitting device.

Furthermore, according to the present invention including the firstengaging part and the second engaging part, when joining thelight-emitting module and the stem, the light-emitting module and thestem can be easily positioned to a desired position and state inconsideration of the direction of installation and polarity.Accordingly, the light bulb shaped lamp can be easily assembled.Furthermore, the light-emitting module and the stem can be fixed firmly,and attached uniformly in the predetermined direction. Accordingly, itis possible to implement a light bulb shaped lamp capable of eliminatingthe variation in the positions of the components between products andimproving the appearance and quality.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a light bulb shaped lamp according tothe embodiment 1 of the present invention.

FIG. 2 is an exploded perspective view of a light bulb shaped lampaccording to the embodiment 1 of the present invention.

FIG. 3 is a front view of a light bulb shaped lamp according to theembodiment 1 of the present invention.

FIG. 4 is a cross-sectional view of an LED module according to theembodiment 1 of the present invention.

FIG. 5 is an enlarged cross-sectional view of a part around an LED chipin an LED module according to the embodiment 1 of the present invention.

FIG. 6 is a circuit diagram of a lighting circuit according to theembodiment 1 of the present invention.

FIG. 7 is a perspective view of an LED module and a stem according tothe variation 1 of the embodiment 1 of the present invention.

FIG. 8 is a cross-sectional view of an LED module and a stem accordingto the variation 1 of the embodiment 1 of the present invention.

FIG. 9 is a perspective view of an LED module and a stem according tothe variation 2 of the embodiment 1 of the present invention.

FIG. 10 is a cross-sectional view of an LED module and a stem accordingto the variation 2 of the embodiment 1 of the present invention.

FIG. 11 is a cross-sectional view of a light bulb shaped lamp accordingto the variation 3 of the embodiment 1 of the present invention.

FIG. 12 is a schematic cross-sectional view of a lighting apparatususing the light bulb shaped lamp according to the embodiment 1 of thepresent invention.

FIG. 13 is a perspective view of a light bulb shaped lamp according tothe embodiment 2 of the present invention.

FIG. 14 is an exploded perspective view of a light bulb shaped lampaccording to the embodiment 2 of the present invention.

FIG. 15 is a front view of a light bulb shaped lamp according to theembodiment 2 of the present invention.

FIG. 16 is a front view of an LED module according to the embodiment 2of the present invention.

FIG. 17 is a cross-sectional view around an LED module according to theembodiment 2 of the present invention in Y-axis direction.

FIG. 18 is a front view of an LED module according to the variation 1 ofthe embodiment 2 of the present invention.

FIG. 19 is a cross-sectional view around an LED module according to thevariation 1 of the embodiment 2 of the present invention in Y-axisdirection.

FIG. 20 is a cross-sectional view around an LED module according to thevariation 2 of the embodiment 2 of the present invention in Y-axisdirection.

FIG. 21 is a cross-sectional view around an LED module according to thevariation 3 of the embodiment 2 of the present invention in Y-axisdirection.

FIG. 22 is a perspective view around an LED module according to thevariation 4 of the embodiment 2 of the present invention.

FIG. 23 is a front view of an LED module according to the variation 4 ofthe embodiment 2 of the present invention.

FIG. 24 is a front view of an LED module according to another aspect ofthe variation 4 of the embodiment 2 of the present invention.

FIG. 25 is a cross-sectional view of a light bulb shaped lamp accordingto the variation 5 of the embodiment 2 of the present invention.

FIG. 26 is a schematic cross-sectional view of a lighting apparatususing the light bulb shaped lamp according to the embodiment 2 of thepresent invention.

FIG. 27 is a perspective view of a light bulb shaped lamp according tothe embodiment 3 of the present invention.

FIG. 28 is an exploded perspective view of a light bulb shaped lampaccording to the embodiment 3 of the present invention.

FIG. 29 is a cross-sectional view of a light bulb shaped lamp accordingto the embodiment 3 of the present invention.

FIG. 30 is an enlarged perspective view of a major part of an LED moduleand a stem in a light bulb shaped lamp according to the embodiment 3 ofthe present invention.

FIG. 31A is a perspective view of an LED module and a stem in a lightbulb shaped lamp according to the variation 1 of the embodiment 3 of thepresent invention from below.

FIG. 31B is a cross-sectional view of an LED module and a stem in alight bulb shaped lamp according to the variation 1 of the embodiment 3of the present invention.

FIG. 32 is a cross-sectional view of an LED module and a stem in a lightbulb shaped lamp according to the variation 2 of the embodiment 3 of thepresent invention.

FIG. 33A is a perspective view of an LED module and a stem in a lightbulb shaped lamp according to the variation 3 of the embodiment 3 of thepresent invention.

FIG. 33B is a cross-sectional view of an LED module and a stem in thelight bulb shaped lamp according to the variation 3 of the embodiment 3of the present invention.

FIG. 34 is a cross-sectional view of an LED module and a stem in a lightbulb shaped lamp according to the variation 4 of the embodiment 3 of thepresent invention.

FIG. 35 is a schematic cross-sectional view of a lighting apparatususing the light bulb shaped lamp according to the embodiment 3 of thepresent invention.

FIG. 36 is a perspective view of an LED module in a light bulb shapedlamp according to the embodiment 3 of the present invention.

FIG. 37 is a perspective view of a light bulb shaped lamp according tothe embodiment 4 of the present invention.

FIG. 38 is an exploded perspective view of a light bulb shaped lampaccording to the embodiment 4 of the present invention.

FIG. 39 is a cross-sectional view of a light bulb shaped lamp accordingto the embodiment 4 of the present invention.

FIG. 40A is a front view of an LED module in a light bulb shaped lampaccording to the embodiment 4 of the present invention.

FIG. 40B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the embodiment 4 of the present invention inline A-A′ in FIG. 40A.

FIG. 41 is an enlarged perspective view of a major part of an LED moduleand a stem according to the embodiment 4 of the present invention.

FIG. 42A is a front view of an LED module in a light bulb shaped lampaccording to the variation 1 of the embodiment 4 of the presentinvention.

FIG. 42B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 1 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 42A.

FIG. 43A is a front view of an LED module in a light bulb shaped lampaccording to the variation 2 of the embodiment 4 of the presentinvention.

FIG. 43B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 2 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 43A.

FIG. 44A is a front view of an LED module in a light bulb shaped lampaccording to the variation 3 of the embodiment 4 of the presentinvention.

FIG. 44B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 3 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 44A.

FIG. 45A is a front view of an LED module in a light bulb shaped lampaccording to the variation 4 of the embodiment 4 of the presentinvention.

FIG. 45B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 4 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 45A.

FIG. 46A is a front view of an LED module in a light bulb shaped lampaccording to the variation 5 of the embodiment 4 of the presentinvention.

FIG. 46B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 5 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 46A.

FIG. 47A is a front view of an LED module in a light bulb shaped lampaccording to the variation 6 of the embodiment 4 of the presentinvention.

FIG. 47B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 6 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 47A.

FIG. 48A is a front view of an LED module in a light bulb shaped lampaccording to the variation 7 of the embodiment 4 of the presentinvention.

FIG. 48B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 7 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 48A.

FIG. 49A is a front view of an LED module in a light bulb shaped lampaccording to the variation 8 of the embodiment 4 of the presentinvention.

FIG. 49B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 8 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 49A.

FIG. 50 is a schematic cross-sectional view of a lighting apparatususing the light bulb shaped lamp according to the embodiment 4 of thepresent invention.

FIG. 51A is a front view of an LED module in a light bulb shaped lampaccording to the variation 9 of the embodiment 4 of the presentinvention.

FIG. 51B is a cross-sectional view of an LED module in a light bulbshaped lamp according to the variation 9 of the embodiment 4 of thepresent invention in line A-A′ in FIG. 51A.

FIG. 52 is a cross-sectional view of a light bulb shaped LED lampaccording to the conventional art.

DESCRIPTION OF EMBODIMENTS

The following shall describe the light-emitting device and the lampaccording to the embodiments of the present invention shall bedescribed. However, the present invention is defined by the Claims.Accordingly, among the components in the embodiment, the components notdescribed in Claims are not necessary for solving the problem of thepresent invention but included for a preferable embodiment. Note that,the diagrams are schematic diagrams, and illustration is not necessarilystrictly accurate. In the drawings, the same reference numerals areassigned to the same components, and the description for thesecomponents shall be omitted or simplified.

Embodiment 1

First, a light bulb shaped lamp 100 according to the embodiment 1 of thepresent invention shall be described with reference to the drawings.

(Overall Configuration of Light Bulb Shaped Lamp 100)

First, the overall configuration of the light bulb shaped lamp 100according to the embodiment 1 shall be described with reference to FIG.1 to FIG. 3.

FIG. 1 is a perspective view of a light bulb shaped lamp according tothe embodiment 1 of the present invention. FIG. 2 is an explodedperspective view of a light bulb shaped lamp according to the embodiment1 of the present invention. FIG. 3 is a front view of a light bulbshaped lamp according to the embodiment 1 of the present invention. Notethat, in FIG. 3, part of the lighting circuit 180 and a lead wire 170for holding and supplying power inside a base 190 are shown in dottedlines.

As illustrated in FIG. 1, the light bulb shaped lamp 100 according tothe embodiment 1 is a light bulb shaped LED lamp replacing anincandescent electric bulb, in which a base 190 is attached to atranslucent globe 110. An LED module 130 on which an LED chip is mountedis housed in the globe 110. The LED module 130 is directly fixed to thestem 120 extending from an opening 111 of the globe 110 toward theinside of the globe 110.

More specifically, as illustrated in FIG. 1 to FIG. 3, the light bulbshaped lamp 100 includes a globe 110, a stem 120, an LED module 130, twolead wires 170, a lighting circuit 180, and a base 190.

The following shall describe components of the light bulb shaped lamp100 with reference to FIG. 1 to FIG. 3.

(Globe 110)

As illustrated in FIG. 1 to FIG. 3, the globe 110 is a hollowtranslucent component, houses the LED module 130 inside, and transmitsthe light from the LED module 130 to outside of the lamp. In theembodiment 1, the globe 110 is a hollow glass bulb made of silica glasstransparent to visible light. Accordingly, the LED module 130 housed inthe globe 110 is visible to a user from outside of the globe 110. Thisstructure of the light bulb shaped lamp 100 suppresses loss of lightfrom the LED chip 150 by the globe 110.

The globe 110 has a shape with one end closed in a spherical shape, andthe other end has the opening 111. In other words, the shape of theglobe 110 is that a part of hollow sphere is narrowed down whileextending away from the center of the sphere, and the opening 111 isformed at a part away from the center of the sphere. In the embodiment1, the shape of the globe 110 is Type A (JIS C7710) which is the same asa common incandescent light bulb.

Note that, the shape of the globe 110 does not have to be Type A. Forexample, the shape of the globe 110 may be Type G, Type E, or others.Furthermore, it is not necessary for the globe 110 to be transparent tovisible light. For example, diffusion treatment may be performed such asa milky white diffusion film formed by coating silica. Alternatively,the globe 110 may be colored in red, yellow, or other colors, or apattern or a picture may be painted thereon. Alternatively, a reflectorfilm or others may be provided on a side closer to the base than thelight source like a reflector light bulb. In addition, it is notnecessary for the globe 110 to be made of silica glass, and may be madeof transparent resin such as acrylic. However, if the globe 110 is madeof glass as described above, the globe 110 is highly resistant to heat.In addition, by forming the thickness of the globe 110 uneven, the lightfrom the LED hits the uneven part, giving a glistening effect to thelight.

(Stem 120)

As illustrated in FIG. 2 and FIG. 3, the stem 120 is a pillar extendedtoward the inside of the globe 110. Stated differently, the stem 120 isprovided extending from the vicinity of the opening 111 of the globe 110to the inside of the globe 110. More specifically, a rod-shaped extendedportion 120 a extending to the vicinity of the LED module 130 in theZ-axis direction is provided on one end of the stem 120. In other words,the stem 120 according to the embodiment 1 is a component that would beobtained by extending the stem used for a common incandescent light bulbextending toward the inside of the globe 110.

The LED module 130 is directly fixed to an end of the extended portion120 a. Note that, the details shall be described later with reference toFIG. 4.

The other end portion of the stem 120 is formed in a flared shapecoinciding with the shape of the opening 111. The other end portion ofthe stem 120 formed in the flared shape is joined with the opening 111of the globe 110 so as to close the opening of the globe 110. Inaddition, parts of two lead wires 170 are partially sealed in the stem120. Accordingly, it is possible to supply power to the LED module 130in the globe 110 from outside of the globe 110 keeping the globe 110airtight. Accordingly, the light bulb shaped lamp 100 can prevent wateror water vapor from entering the globe 110 for a long period of time,and it is possible to suppress the degradation of the LED module 130 anda part connecting the LED module 130 and the lead wire 170 due tomoisture.

The stem 120 is made of soft glass transparent to visible light. Thisstructure of the light bulb shaped lamp 100 suppresses loss of lightfrom the LED chip 150 by the stem 120. In addition, the light bulbshaped lamp 100 can prevent the shadow cast by the stem 120.Furthermore, light emitted by the LED chip 150 lights up the stem 120.Thus, the light bulb shaped lamp 100 can achieve visually superiorappearance.

Note that, it is not necessary for the stem 120 to be transparent to thevisible light, or to be made of soft glass. For example, the stem 120may be a component made of a highly heat-conductive resin. As the highlyheat-conductive resin, silicone resin in which metal particles such asalumina or zinc oxide are mixed may be used. In this case, the lightbulb shaped lamp 100 can actively transfer the heat generated at the LEDmodule 130 to the globe 110 or the base 190 through the stem 120. As aresult, the light bulb shaped lamp 100 is capable of suppressingreduction in light-emission efficacy and reduction in product life ofthe LED chip 150 due to increased temperature.

Furthermore, it is not always necessary for the stem 120 to close theopening at the globe 110, and the stem 120 may be attached to a part ofthe opening 111.

(LED Module 130)

FIG. 4 is a cross-sectional view of an LED module 130 according to theembodiment 1 of the present invention. FIG. 5 is an enlargedcross-sectional view around the LED chip in an LED module 130 accordingto the embodiment 1 of the present invention.

The LED module 130 corresponds to a light-emitting module which is alight source of the light bulb shaped lamp 100, and is housed in theglobe 110. It is preferable that the LED module 130 is positioned at thecenter of the spherical shape formed by the globe 110 (for example,inside a large diameter part at which the inner diameter of the globe110 is large). With the LED module 130 positioned at the center, thelight bulb shaped lamp 100 can achieve omnidirectional lightdistribution property when the light bulb shaped lamp 100 is switchedon. The omnidirectional light distribution property is approximated to acommon incandescent light bulb using conventional filament coil.

As illustrated in FIG. 4, the LED module 130 is a chip-on-board (COB)light-emitting module in which the LED chips are directly mounted on theboard, and includes a base platform 140, LED chips 150, and a sealingmaterial 160. The LED module 130 is provided with the surface on whichthe LED chips 150 are mounted facing the top of the globe 110 (in apositive direction of Z-axis direction). The following shall describecomponents of the LED module 130 in detail.

(Base Platform 140)

The base platform 140 is composed of a material translucent to visiblelight, and more specifically, it is a ceramic component containingalumina. It is preferable that the base platform 140 is a componenthaving high transmittance of visible light. With this, the light emittedfrom the LED chip 150 passes through the inside of the base platform140, and the light is emitted from a part on which no LED chip 150 ismounted. Accordingly, even when the LED chip 150 is mounted only on oneside of the base platform, the light is emitted from the other surfaces,allowing achievement of the light distribution property equivalent tothat of an incandescent light bulb.

Note that, the base platform 140 does not have to be translucent. Inthis case, the LED chips 150 may be mounted on more than one side of thebase platform 140, for example.

The shape of the base platform 140 is a quadrangular prism (20 mm inlength (X-axis direction), 1 mm in width (Y-axis direction), and 0.8 mmin thickness (Z-axis direction)). Since the shape of the base platform140 is a quadrangular prism, the light bulb shaped lamp 100 canreproduce the filament of an incandescent light bulb by the LED module130 in a simulative manner. Note that, the shape and size of the baseplatform 140 are merely example, and may be in other shapes and sizes.

Power supply terminals 141 are provided on the ends of the base platform140 in the longer direction (X-axis direction). The two lead wires 170are electrically and physically connected to the power supply terminals141 by solder, respectively.

Furthermore, the base platform 140 is directly fixed to the stem 120.With this structure, the LED module 130 is directly fixed to the stem120. More specifically, a side of the base platform 140 is directlyfixed to an end of the stem 120 by the adhesive material 142. To put itdifferently, the base platform 140 (LED module 130) being directly fixedto the stem 120 includes the following two cases: the base platform 140is in contact with and fixed to the stem 120 (extended portion 120 a);and the base platform 140 (LED module 30) is fixed to the stem 140(extended portion 120 a) via the adhesive material 142 as illustrated inFIG. 4. As described above, since the base platform 140 and the stem 120are fixed by the adhesive material 142, the base platform 140 is firmlyfixed to and held by the stem 120.

The adhesive material 142 is transparent to visible light, and istypically adhesive made of silicone resin. As described above, theadhesive material 142 is transparent to visible light. Accordingly, thelight bulb shaped lamp 100 can reduce the loss of light emitted by theLED chip 150 by the adhesive material 142. In addition, the light bulbshaped lamp 100 can prevent the shadow cast by the adhesive material142.

Note that, the adhesive material 142 may not only include adhesive, butmay be a seat component on which adhesive is applied on each side.Furthermore, it is not necessary for the adhesive to be made of siliconeresin.

Note that, it is preferable that the base platform 140 is made of amaterial having a high thermal conductivity and high thermal emissivityin heat radiation so as to increase heat-radiating property. Morespecifically, the material for the base platform 140 is preferably amaterial referred to as a hard brittle material, which is a generic termfor glass, ceramic, and others. Here, the emissivity is represented by aratio with respect to heat emission on black body (full radiator), andhas a value between 0 and 1. The emissivity of glass or ceramic is 0.75to 0.95, and heat emission close to the black body radiation isachieved. In terms of practical use, the emissivity of the base platform140 is preferably 0.8 or higher, and is more preferably 0.9 or higher.

(LED Chip 150)

The LED chip 150 is an example of the semiconductor light-emittingdevice, and is a blue LED which emits blue light when energized in theembodiment 1. The LED chips 150 are mounted on one side of the baseplatform 140. More specifically, 12 LED chips are arranged in a straightline between the two power supply terminals 141.

As illustrated in FIG. 5, the LED chip 150 is elongated vertically (600μm in length, 300 μm in width, and 100 μm in thickness). The LED chip150 includes a sapphire board 151 and nitride semiconductor layers 152each having different composition, and are stacked above the sapphireboard 151.

A cathode 153 and an anode 154 are formed at an end portion of the uppersurface of the nitride semiconductor layer 152. Wire bonding portions155 and 156 are formed on the cathode 153 and the anode 154,respectively.

The cathode 153 and the anode 154 in the LED chips 150 next to eachother are electrically connected in series by a gold wire 157 throughthe wire bonding portions 155 and 156. The cathode 153 or the anode 154in the LED chips 150 at the ends is connected to a power supply terminal141 by the gold wire 157.

Each of the LED chips 150 is mounted on the base platform 140 bytranslucent chip bonding material 158 such that a surface of the LEDchip 150 on the sapphire board 151 side faces the mounting surface ofthe base platform 140.

Silicone resin including filler made of metal oxide may be used as thechip bonding material, for example. Using the translucent material forthe chip bonding material can reduce the loss of light emitted from thesurface of the LED chip 150 on the side of the sapphire board 151 andthe side surfaces of the LED chip 150, preventing the shadow cast by thechip bonding material.

Note that, in the embodiment 1, an example in which the LED chips 150are mounted on the base platform 140 has been illustrated. However, thenumber of the LED chips 150 may be changed when necessary according tothe use of the light bulb shaped lamp 100. For example, as a replacementfor a miniature light bulb, one LED chip 150 may be mounted on the baseplatform 140.

(Sealing Material 160)

The sealing material 160 is a translucent component, and is formedcovering the LED chips 150. More specifically, the sealing material 160is made of translucent resin such as silicone resin in whichpredetermined phosphor particles which is a wavelength conversionmaterial (not illustrated) and light diffusion material (notillustrated) are included.

The sealing material 160 is formed by the following two processes, forexample. First, in the first process, the sealing material 160 which isan uncured paste including the wavelength conversion material is appliedin a continuous straight line on the LED chips 150 by a dispenser. Next,in the second process, the applied paste of sealing material 160 iscured.

The cross-section in X-axis direction of the sealing material 160 formedas described above is dome-shaped, and is 1 mm wide and 0.2 mm high.Note that, the width in the cross section of the sealing material 160 inY-axis direction is identical to the width of the base platform 140.

Part of the blue light emitted by the LED chip 150 is absorbed by thewavelength conversion material in the sealing material 160, and isconverted into the light in another wavelength. For example, if YAGphosphor such as (Y, Gd)₃Al₅O₁₂:Ce³⁺, Y₃Al₅O₁₂:Ce³⁺ is used as thewavelength conversion material, part of the blue light emitted by theLED chip 150 is converted into yellow light. The blue light not absorbedby the wavelength conversion material and the yellow light which isconverted are diffused and mixed in the sealing material 160. Afterthat, the mixed light is emitted from the sealing material 160 as whitelight.

Particles such as silica are used as the light diffusion material. Sincethe base platform 140 is translucent, the white light emitted from thelinear sealing material 160 passes through the inside of the baseplatform 140 and is emitted from the side surfaces of the base platform140 where no LED chip 150 is mounted. Accordingly, when the light bulbshaped lamp 100 is turned on, the base platform 140 shines like afilament coil of a conventional incandescent light bulb when viewed fromany side of the surface of the base platform 140.

Note that the sealing material 160 may be provided on a surface where noLED chip 150 is provided. With this, part of the blue light whichtransmits inside the base platform 140 and is emitted from the sidesurfaces on which no LED chip 150 is mounted is converted to yellowlight. Accordingly, it is possible to change the color of light emittedfrom the side surfaces on which no LED chip 150 is mounted closer to thecolor of light is directly emitted from the sealing material 160.

Note that, the wavelength conversion material included in the sealingmaterial 160 may be a yellow phosphor such as (Sr, Ba)₂SiO₄:Eu²⁺,Sr₃SiO₅:Eu²⁺, for example. Alternatively, the wavelength conversionmaterial may be a green phosphor such as (Ba, Sr)₂SiO₄:Eu²⁺,Ba₃Si₆O₁₂N₂:Eu²⁺. Alternatively, the wavelength conversion material maybe a red phosphor such as CaAlSiN₃:Eu²⁺, Sr₂(Si, Al)₅(N, O)₈:Eu²⁺.

The sealing material 160 may not be necessarily be made of siliconeresin, and may be made of an organic material such as fluorine seriesresin or an inorganic material such as a low-melting-point glass or asol-gel glass. Since the inorganic materials are more highly resistantto heat than the organic material, the sealing material 160 made ofinorganic material is advantageous to increasing luminance.

(Lead Wire 170)

Two lead wires 170 support the LED module 130, and hold the LED module130 at a constant position in the globe 110. The power supplied from thebase 190 is supplied to the LED chips 150 through the two lead wires170. Each of the lead wires 170 is a composite wire including aninternal lead wire 171, a Dumet wire (copper-clad nickel steel wire) 172and an external lead wire 173 joined in this order.

The internal lead wire 171 is the electric wire extending from the stem120 to the LED module 130, is joined with the base platform 140, andsupports the LED module 130. The Dumet wire 172 is sealed in the stem120. The external lead wire 173 is an electric wire extending from thelighting circuit 180 to the stem 120.

Here, it is preferable that the lead wire 170 is a metal wire includingcopper having high thermal conductivity. With this, the heat generatedat the LED module 130 can be actively transferred to the base 190through the lead wire 170.

Note that, the lead wire 170 does not necessarily have to be a compositewire, and may be a single wire made of the same metal wire. In addition,two lead wires 170 do not have to be provided. For example, when thelight bulb shaped lamp 100 includes a plurality of the LED modules 130in the globe 110, two lead wires 170 may be provided for each of the LEDmodules 130. Accordingly, the light bulb shaped lamp 100 may include thelead wires 170 twice in number as the number of the LED modules 130.

In addition, it is preferable for the lead wire 170 to be attached tothe base platform 140 as if pressing the base platform 140 toward thestem 120. With this, the base platform 140 can be fixed and held to thestem 120 more firmly.

(Lighting Circuit 180)

The lighting circuit 180 is a circuit for causing the LED chips 150 toemit light, and is housed in the base 190. More specifically, thelighting circuit 180 includes a plurality of circuit elements, and acircuit board on which each of the circuit elements is mounted. In thisembodiment, the lighting circuit 180 converts the AC power received fromthe base 190 to the DC power, and supplies the DC power to the LED chips150 through the two lead wires 170.

FIG. 6 is a circuit diagram of the lighting circuit 180 according to theembodiment 1 of the present invention. As illustrated in FIG. 6, thelighting circuit 180 includes a diode bridge 183 for rectification, acapacitor 184 for smoothing, and a resistor 185 for adjusting current.Input terminals of the diode bridge 183 are connected to input terminals181 of the lighting circuit 180. One of the output terminals of thediode bridge 183 and one end of the resistor 185 are connected to theoutput terminals 182 of the lighting circuit 180. An end of thecapacitor 184 and the other end of the resistor 185 are connected to theother of the output terminals of the diode bridge 183.

The input terminal 181 is electrically connected to the base 190. Morespecifically, one of the input terminals 181 is connected to the screw191 on the side surface of the base 190. The other of the inputterminals 181 is connected to the eyelet 192 at the bottom of the base190.

The output terminals 182 are connected to the lead wires 170, and areelectrically connected to the LED chips 150.

Note that, the light bulb shaped lamp 100 does not have to include thelighting circuit 180. For example, the lighting circuit 180 is notnecessary for the light bulb shaped lamp 100 when the DC power isdirectly supplied from a battery cell or others. In this case, one ofthe external lead wires 173 is connected to the screw 191, and the otherof the external lead wire 173 is connected to the eyelet 192.

Note that, the lighting circuit 180 is not limited to a smoothingcircuit, but may be an appropriate combination of light-adjustingcircuit, voltage booster, and others.

(Base 190)

The base 190 is provided at the opening 111 of the globe 110. Morespecifically, the base 190 is attached to the globe 110 using anadhesive such as cement to cover the opening 111 of the globe 110. Inthis embodiment, the base 190 is an E26 base. The light bulb shaped lamp100 is attached to a socket for E26 base connected to the commercial ACpower source for use.

Note that, the base 190 does not have to be an E26 base, and maybe abase of other size, such as E17. In addition, the base 190 does not haveto be a screw base, and may be a base in a different shape such as aplug-in base.

Furthermore, the base 190 is directly attached to the opening 111 of theglobe 110. However, the configuration is not limited to this example.The base 190 may be indirectly attached to the globe 110. For example,the base 190 may be attached to the globe 110 through a resin componentsuch as a resin case. The lighting circuit 180 and others may be housedin the resin case, for example.

As described above, according to the light bulb shaped lamp 100according to the embodiment, the base platform 140 on which the LED chip150 is directly fixed to the stem 120. Accordingly, it is possible tofix and hold the base platform 140 firmly at a constant position in theglobe 110 than a case in which only the lead wires 170 supports the base140. Since the base 190 is attached to the globe 110 housing the LEDchip 150 inside, the light emitted by the LED chip 150 is not blocked bythe case. Accordingly, it is possible to achieve the light distributionproperty equivalent to the conventional incandescent light bulbs.

Furthermore, according to the light bulb shaped lamp 100 according tothe embodiment 1, the heat generated at the LED chip 150 may betransferred to the globe 110 or the base 190 through the stem 120.Accordingly, it is possible to suppress the increase in the temperatureof the LED chip 150. The stem 120 for fixing the base platform 140 isalso used for incandescent light bulbs in general. Accordingly, it ispossible to manufacture the light bulb shaped lamp 100 using themanufacturing facility for incandescent light bulbs.

Variation of Embodiment 1

The following shall describe a variation of the light bulb shaped lamp100 according to the embodiment 1 of the present invention.

Variation 1 of Embodiment 1

First, the variation 1 of the embodiment 1 of the present inventionshall be described.

The light bulb shaped lamp according to the variation 1 of theembodiment 1 of the present invention is different from the light bulbshaped lamp 100 according to the embodiment 1 mostly in that the baseplatform 140 is board shaped. The following shall describe the lightbulb shaped lamp according to the variation with reference to thedrawings. Note that, illustration and description for the componentsidentical to the embodiment are omitted where appropriate.

FIG. 7 is a perspective view of the LED module 130 and the stem 120according to the variation 1 of the embodiment 1 of the presentinvention. FIG. 8 is a cross-sectional view of the LED module 130 andthe stem 120 according to the variation 1 of the embodiment 1 of thepresent invention.

The base platform 140 is a translucent component made of ceramiccontaining aluminum nitride. The base platform 140 is board shaped (20mm in length, 10 mm in width, and 0.8 mm in thickness).

Power supply terminals 141 are provided at the diagonal corners of thebase platform 140. Each of the two lead wires 170 has an end bent inL-shape, and is electrically and physically connected to the powersupply terminal 141 by solder.

A metal line pattern 143 is formed on one side (surface) of the baseplatform 140, and the LED chip 150 is mounted thereon. Power is suppliedto the LED chip 150 through the metal line pattern 143. The line patternmay be formed by a translucent conductive material such as indium tinoxide (ITO). In this case, it is possible to suppress the loss of lightemitted by the LED chip 150, compared to the metal line pattern.

More specifically, the other side (back surface) of the base platform140 is directly fixed to an end of the stem 120 by the adhesive material142.

The LED chip 150 is a semiconductor light-emitting device which emitsviolet light when energized. More specifically, one row consists of 10LED chips 150 and 30 LED chips 150 are mounted in three rows. With this,the light bulb shaped lamp 100 can reproduce an incandescent light bulbhaving three filament coils.

The sealing material 160 is a translucent component, and is provided tocover the row of LED chips 150. The sealing material 160 includes bluephosphor, green phosphor, and red phosphor as the wavelength conversionmaterial. Accordingly, the violet light emitted by the LED chip 150 isconverted into white light.

As described above, according to the light bulb shaped lamp according tothe variation, the board-shaped base platform 140 may be fixed to theend of the stem 120 on one surface. Accordingly, it is possible tofirmly fix and hold the base platform 140 at a constant position in theglobe 110 compared to a case where the base platform 140 is supportedonly by the lead wires 170.

Variation 2 of Embodiment 1

Next, the variation 2 of the embodiment 1 of the present invention shallbe described.

The light bulb shaped lamp according to the variation 2 of theembodiment 1 of the present invention is different from the light bulbshaped lamp according to the variation 1 in that a recess is provided onthe back surface of the base platform of the light bulb shaped lampaccording to the variation 1. The following shall describe the lightbulb shaped lamp according to the variation with reference to thedrawings. Note that, illustration and description for the componentsidentical to the embodiment 1 or the variation 1 of the embodiment 1 areomitted where appropriate.

FIG. 9 is a perspective view of the LED module 130 and the stem 120according to the variation 2 of the embodiment 1 of the presentinvention from below. FIG. 10 is a cross-sectional view of the LEDmodule 130 and the stem 120 according to the variation 2 of theembodiment 1 of the present invention.

In the variation 2, the base platform 140 has a recess 144 on the backsurface. The base platform 140 is fixed to the stem 120 by an endportion of the stem 120 fitting in the recess 144.

As described above, since the end portion of the stem 120 is fit intothe recess 144 provided in the back surface of the base platform 140, itis possible to prevent the base platform 140 from moving, and thus thebase platform 140 can be fixed and held even more firmly.

Furthermore, the base platform 140 is fit into the stem 120 through therecess 144. Accordingly, it is possible to fix and hold the baseplatform 140 firmly without using adhesive.

Variation 3 of Embodiment 1

Next, the variation 3 of the embodiment 1 of the present invention shallbe described.

The light bulb shaped lamp according to the variation 3 of theembodiment 1 of the present invention is mostly different from the lightbulb shaped lamp according to the embodiment in the shape of the stem120. The following shall describe the light bulb shaped lamp accordingto the variation with reference to the drawings. Note that, illustrationand description for the components identical to the embodiment 1 areomitted where appropriate.

FIG. 11 is a cross-sectional view of the light bulb shaped lampaccording to the variation 3 of the embodiment 1 of the presentinvention. In FIG. 11, the stem 120 is a rod-shaped component made ofmetal, ceramic, or glass. One end of the stem 120 is inserted into ahole 122 defined by a surface of a circular board component 121 closingthe opening 111 of the globe 110, and fixed by using adhesive made ofsilicone resin or others. The other end of the stem 120 is fixed to thebase platform 140 using the adhesive 142, in the same manner as theembodiment described above.

The board component 121 is fit into the opening of the base 190, and acutout 123 is provided at the periphery of the board component 121. Theopening 111 of the globe 110 is inserted into a groove defined by thecutout 123 and the base 190, and the globe 110 is fixed by the adhesivematerial 124 made of silicone resin or others.

Each of the lead wires 170 is inserted into a through hole 145 definedby the base platform 140, and is fixed to the base platform 140. Each ofthe lead wires 170 is also inserted into through hole defined by theboard component 121, and is fixed to the board component 121.

As described above, according to the light bulb shaped lamp according tothe variation, the rod-shaped stem 120 fixed to the board component 121can fix and hold the LED module 130 at a constant position in the globe110 firmly. Each of the lead wires 170 is inserted into the through hole145 defined by the base platform 140, and is fixed to the base platform140. Accordingly, when the light bulb shaped lamp is shaken, forexample, it is possible to prevent lead wires 170 from beingdisconnected from the LED module 130.

Note that, it is preferable that the axial directions of the two throughholes 145 defined by the base platform 140 are different from eachother. With this, even if a force is exerted on the base platform 140toward the axial direction of one of the through holes 145, the leadwire 170 inserted into the other through hole 145 can regulate the moveof the base platform 140 in the direction of the force. Accordingly, itis possible to suppress the possibility that the lead wires 170 aredisconnected from the LED module 130 due to vibration or others evenmore securely.

The light bulb shaped lamp according to an aspect of the presentinvention has been described based on the embodiment and the variations.However, the present invention is not limited to the embodiments.

For example, in the embodiment, the light bulb shaped lamp 100 receivesAC power from a commercial AC power source. However, the light bulbshaped lamp 100 may receive DC power from a battery cell or others, forexample. In this case, the light bulb shaped lamp 100 does not have toinclude the lighting circuit 180 illustrated in FIG. 6.

Furthermore, the present invention may not only be implemented as thelight bulb shaped lamp, but also as a lighting apparatus including thelight bulb shaped lamp. The following shall describe the lightingapparatus according to an aspect of the present invention with referenceto FIG. 11.

FIG. 12 is a schematic cross-sectional view of the lighting apparatus500 according to the embodiment 1 of the present invention.

The lighting apparatus 500 is used attached to a ceiling 600 in a room,for example, and includes the light bulb shaped lamp 100 according tothe embodiment and a lighting equipment 520.

The lighting equipment 520 is for turning the light bulb shaped lamp 100on and off, and includes an equipment body 521 attached to the ceiling600 and a lamp cover 522 covering the light bulb shaped lamp 100.

The equipment body 521 includes a socket 521 a. A base 190 of the lightbulb shaped lamp 100 is screwed into the socket 521 a. Power is suppliedto the light bulb shaped lamp 100 through the socket 521 a.

Note that the lighting apparatus 500 described here is an example of thelighting apparatus according to an aspect of the present invention. Thelighting apparatus according to an aspect of the present invention mayinclude at least a socket for holding the light bulb shaped lamp 100 andsupplying power to the light bulb shaped lamp 100. Note that, the base190 does not have to be screwed into the base 190, but may be simplyinserted.

Furthermore, the lighting apparatus 500 illustrated in FIG. 12 includesone light bulb shaped lamp 100. However, the lighting apparatus 500 mayinclude more than one light bulb shaped lamp 100.

Embodiment 2

Next, a light bulb shaped lamp 200 according to the embodiment 2 of thepresent invention shall be described with reference to the drawings.

(Overall Configuration of Light Bulb Shaped Lamp 200)

FIG. 13 is a perspective view of the light bulb shaped lamp according tothe embodiment 2 of the present invention. FIG. 14 is an explodedperspective view of the light bulb shaped lamp according to theembodiment 2 of the present invention. FIG. 15 is a front view of thelight bulb shaped lamp according to the embodiment 2 of the presentinvention. Note that, in FIG. 15, part of the lighting circuit 180 and alead wire 170 inside a base 190 is shown in dotted lines.

As illustrated in FIG. 13, the light bulb shaped lamp 200 according tothe embodiment 2 is a light bulb shaped LED lamp replacing anincandescent electric bulb, in which a base 190 is attached to atranslucent globe 110. LED modules 230 on which an LED chip is mountedare housed in the globe 110. The LED modules 230 are fixed to a fixingcomponent 225 in the globe 110, and the fixing component 225 issupported by the stem 120 inserted into the through hole defined by thefixing component 225. Note that, in the embodiment 2, one LED module(light-emitting module) is composed of the LED modules 230 and thefixing component 225.

More specifically, as illustrated in FIG. 1 to FIG. 3, the light bulbshaped lamp 200 includes the globe 110, the stem 120, a fixing component225, two LED modules 230, the two lead wires 170, the lighting circuit180, and the base 190.

Components of the light bulb shaped lamp 200 shall be described indetail with reference to FIG. 13 to FIG. 15 as follows.

(Globe 110)

As illustrated in FIG. 13 to FIG. 15, the globe 110 is a translucenthollow component, houses the LED module 230 inside, and transmits thelight from the LED module 230 to outside of the lamp, in the same manneras the embodiment 1. In the embodiment 2, the globe 110 is a hollowglass bulb made of silica glass transparent to visible light as well. Inthe embodiment 2, the shape of the globe 110 is Type A (JIS C7710) whichis the same as a common incandescent light bulb, that is, the globe 110has a shape with one end closed in a spherical shape, and the other endhas an opening 111.

(Stem 120)

As illustrated in FIG. 14 and FIG. 15, the stem 120 is a pillar extendedtoward the inside of the globe 110, in the same manner as theembodiment 1. Stated differently, the stem 120 is provided extendingfrom the proximity of the opening 111 of the globe 110 to the inside ofthe globe 110. More specifically, a rod-shaped extended portion 120 aextending to the proximity of the LED module 230 in the Z-axis directionis provided in one end of the stem 120.

The end portion of the extended portion 120 a has a projecting shape.Stated differently, unlike the embodiment 1, a stepped part 120 b isformed at the end portion of the extended portion 120 a. The extendedportion 120 a is inserted into the through hole 226 a defined by thefixing component 225, and supports the fixing component 225 using thestepped part 120 b. To put it differently, the stepped part 120 bregulates the movement of the fixing component 225 toward the stem 120(in the negative direction of the Z-axis).

Note that, it is not necessary for the end portion of the extendedportion 120 a to have a projecting shape. In addition, it is notnecessary for the end portion of the extending portion 120 a to have astepped part 120 b. For example, the end portion of the extended portion120 a may have a conical trapezoid shape. Even in this case, if theupper base of the conical trapezoid is smaller than the through hole 226a (not illustrated), and the lower base is larger than the through hole226 a, the stem 120 can regulate the movement of the fixing component225 toward the stem 120.

The other end portion of the stem 120 is formed in a flared shapecoinciding with the shape of the opening 111, in the same manner as theembodiment 1. The other end portion of the stem 120 formed in the flaredshape is joined with the opening 111 of the globe 110 so as to close theopening of the globe 110. In addition, parts of two lead wires 170 arepartially sealed in the stem 120. The stem 120 is made of soft glasstransparent to visible light.

(Fixing Component 225)

FIG. 16 is a plan view of the LED module 230 according to the embodiment2 of the present invention. FIG. 17 is a cross-sectional view of a partaround the LED module 230 according to the embodiment 2 of the presentinvention in Y-axis direction.

The fixing component 225 is a board-shaped component transparent tovisible light, made of glass, resin, or others. Two LED modules 230 arefixed to the fixing component 225, which defines the through hole 226 a.More specifically, each of the base platforms 140 in the two LED modules230 is attached to the fixing component 225.

The through hole 226 a corresponds to the first through hole,penetrating the fixing component 225 in the Z-axis direction. In theembodiment 2, the through hole 226 a is circular, and substantiallyidentical to the shape of the cross-section of the end portion of theextended portion 120 a. To put it differently, the end portion of theextended portion 120 a is fit into the through hole 226 a. The endportion of the stem 120 is directly fixed to the fixing component 225 bythe adhesive material 227 made of silicone resin and others. Asdescribed above, the fixing component 225 is directly fixed to the stem120. Accordingly, the light bulb shaped lamp 200 can suppress thepossibility that the lead wire 170 is disconnected from the LED module230.

Here, it is preferable that the adhesive material 227 is transparent tovisible light. Accordingly, it is possible to suppress the loss of lightemitted by the LED chip 150 by the adhesive material 227. Furthermore,it is possible to prevent a shadow cast by the adhesive material 227.

Note that, it is not necessary for the fixing component 225 to be fixedto the stem 120, and may simply be supported. Even in this case, it ispossible to suppress the stress exerted on the part connecting the leadwire 170 and the LED module 230 when the light bulb shaped lamp 200 isshaken, for example, and to suppress the possibility that the lead wire170 is disconnected from the LED module 230.

Furthermore, it is not necessary for the fixing component 225 to be acomponent transparent to visible light, and may be a component made ofmetal or ceramic, for example. Furthermore, it is not necessary for thefixing component 225 to be in a board shape.

(LED Module 230)

The two LED modules 230 correspond to the light-emitting module which isa light source of the light bulb shaped lamp 200, and is provided in theglobe 110. It is preferable that the two LED modules 230 are positionedat the proximity of the center of the spherical shape formed by theglobe 110 (for example, inside a large diameter part at which the innerdiameter of the globe 110 is large). With the LED module 230 positionedin the proximity of the center, the light bulb shaped lamp 200 canachieve omnidirectional light distribution property when the light bulbshaped lamp 200 is switched on. The omnidirectional light distributionproperty is approximated to a common incandescent light bulb usingconventional filament coil.

In addition, the two LED modules 230 are fixed to the fixing component225 such that the barycenter of the fixing component 225 and the LEDmodules 230 coincides with the center of the through hole 226 a withrespect to the longer direction of the stem 120 (Z-axis direction).Here, the two LED modules 230 have the same shape and size, and thus thetwo LED modules 230 are arranged symmetric with respect to the center ofthe through hole 226 a. With this configuration, the stem 120 cansupport the fixing component 225 and the two LED modules 230 stably.

As illustrated in FIG. 17, each of the two LED modules 230 is a COBlight-emitting module in which the LED chips are directly mounted on thebase platform, and includes a base platform 140, LED chips 150, and asealing material 160 in the same manner as the embodiment 1. The two LEDmodules 230 are provided with the first surface (hereinafter alsoreferred to as “surface”) on which the LED chips 150 are mounted facingthe top of the globe 110 (in a positive direction of Z-axis direction).

Note that, the number of the LED modules 230 is not necessarily two, andmay be three or more. As described above, even if there are three ormore LED modules 230, it is possible to suppress the possibility thatthe lead wire 170 is disconnected from the LED module 230 when the lightbulb shaped lamp is shaken, for example, by fixing the LED modules 230to the fixing component 225.

(Base Platform 140)

The base platform 140 is a board component translucent to visible light,and is a ceramic component containing alumina, in the same manner as theembodiment 1. Note that, in the embodiment 2, the base platform 140 isfixed to the fixing component 225 by the adhesive material (notillustrated).

It is preferable that the base platform 140 is a component having hightransmittance of visible light. With this configuration, the lightemitted by the LED chip 150 passes through the inside of the baseplatform 140, and is emitted from the second surface (hereinafter alsoreferred to as the back surface) opposite to the first surface. No LEDchip 150 is mounted on the back surface. Accordingly, even when the LEDchip 150 is mounted only on one side of the base platform, the light isemitted from the other surfaces, allowing achievement of the lightdistribution property equivalent to that of an incandescent light bulb.

Note that, the base platform 140 does not have to be translucent. Inthis case, the LED chips 150 may be mounted on the back surface of thebase platform 140, for example. The shape of the base platform 140 is anexample, and may be in other shape such as a shape of prism.

Power supply terminals 141 are provided on the ends of the two baseplatforms 140 in the longer direction (X-axis direction). The outerpower supply terminals 141 are electrically and physically connected tothe lead wire 170 by a joining material such as solder. The inner powersupply terminals 141 are electrically connected to each other by anelectric wire 244 such as a gold wire.

Note that, it is preferable that the base platform 140 is made of amaterial having a high thermal conductivity and high thermal emissivityin heat radiation so as to increase heat-radiating property, in the samemanner as the embodiment 1. More specifically, the material for the baseplatform 140 is preferably a material referred to as a hard brittlematerial, which is a generic term for glass, ceramic, and others.

(LED Chip 150)

The LED chip 150 is an example of the semiconductor light-emittingdevice, and is a blue LED which emits blue light when energized in theembodiment 2 as well. The LED chips 150 are mounted on a surface of thebase platform 140. More specifically, 5 LED chips 150 are arranged in astraight line between the two power supply terminals 141 in theembodiment 2. The configuration around the LED chips 150 is identical toFIG. 5. Accordingly, the description shall be omitted.

Note that, an example in which the LED chips 150 are mounted on the baseplatform 140 has been illustrated. However, the number of the LED chips150 may be changed according to the use of the light bulb shaped lamp200 in the embodiment 2 as well. For example, as a replacement for aminiature light bulb, one LED chip 150 may be mounted on the baseplatform 140.

(Sealing Material 160)

The sealing material 160 is a translucent component, and is formedcovering the LED chips 150, in the same manner as the embodiment 1. Morespecifically, the sealing material 160 is made of translucent resin suchas silicone resin in which predetermined phosphor particles which is awavelength conversion material (not illustrated) and light diffusionmaterial (not illustrated) are included. Note that, the details of thesealing material 160, such as the material, shape, manufacturing methodand others are identical to the embodiment 1. Accordingly, thedescription shall be omitted.

(Lead Wire 170)

The two lead wires 170 support the LED modules 230 in the same manner asthe embodiment 1. The power supplied from the base 190 is supplied tothe LED chips 150 through the two lead wires 170. Each of the lead wires170 is a composite wire including an internal lead wire 171, a Dumetwire (copper-clad nickel steel wire) 172 and an external lead wire 173joined in this order, and has a strength sufficient to support the LEDmodule 230.

The internal lead wire 171 extends from the stem 120 toward the LEDmodule 230, and has an end bent into L-shape joined to the base platform140 so as to support the LED module 230. The Dumet wire 172 is sealed inthe stem 120. The external lead wire 170 extends from the lightingcircuit 180 to the stem 120.

Here, it is preferable that the lead wire 170 is a metal wire includingcopper having high thermal conductivity, in the same manner as theembodiment 1. Note that, the lead wire 170 does not necessarily have tobe a composite wire, and may be a single wire made of the same metalwire. In addition, it is not necessary that the two lead wires 170 areincluded.

(Lighting Circuit 180)

The lighting circuit 180 is a circuit for causing the LED chips 150 toemit light, and is housed in the base 190, in the same manner as theembodiment 1. More specifically, the lighting circuit 180 includes aplurality of circuit elements, and a circuit board on which each of thecircuit elements is mounted. In this embodiment, the lighting circuit180 converts the AC power received from the base 190 to the DC power,and supplies the DC power to the LED chips 150 through the two leadwires 170. Note that, the description for the circuit configuration ofthe lighting circuit 180 shall be omitted, since the circuitconfiguration is identical to the configuration in FIG. 6.

Note that, it is not necessary for the light bulb shaped lamp 200 toinclude the lighting circuit 180. For example, the lighting circuit 180is not necessary for the light bulb shaped lamp 200 when the DC power isdirectly supplied from a battery cell, or others. In this case, one ofthe external lead wires 173 is connected to the screw 191, and the otherof the external lead wire 173 is connected to the eyelet 192.

Note that, the lighting circuit 180 is not limited to a smoothingcircuit, but may be an appropriate combination of light-adjustingcircuit, voltage booster, and others.

(Base 190)

The base 190 is provided at the opening 111 of the globe 110, in thesame manner as the embodiment 1. More specifically, the base 190 isattached to the globe 110 using an adhesive such as cement to cover theopening 111 of the globe 110. In this embodiment, the base 190 is an E26base. The light bulb shaped lamp 200 is attached to a socket for E26base connected to the commercial AC power source for use.

Note that, the base 190 does not have to be an E26 base, and maybe abase of other size, such as E17. In addition, the base 190 does not haveto be a screw base, and may be a base in a different shape such as aplug-in base.

Furthermore, the base 190 is directly attached to the opening 111 of theglobe 110. However, the configuration is not limited to this example.The base 190 may be indirectly attached to the globe 110. For example,the base 190 may be attached to the globe 110 through a resin componentsuch as a resin case. The lighting circuit 180 and others may be housedin the resin case, for example.

As described above, according to the light bulb shaped lamp 200according to the embodiment 2, the stem 120 inserted into the throughhole 226 a defined by the fixing component 225 can support the fixingcomponent 225 to which the LED modules 230 are fixed. Accordingly, it ispossible to suppress the stress exerted on the part connecting the leadwire 170 and the LED module 230 when the light bulb shaped lamp 200 isshaken, for example, and to suppress the possibility that the lead wire170 is disconnected from the LED module 230. In addition, since the base190 is provided at the opening 111 of the globe 110 housing the LEDmodule 230 inside, the light generated by the LED chip 150 is notblocked by the case. Accordingly, it is possible to achieve the lightdistribution property equivalent to that of conventional incandescentlight bulbs.

Variation of Embodiment 2

The following shall describe a variation of the light bulb shaped lamp200 according to the embodiment 2 of the present invention.

Variation 1 of Embodiment 2

First, the variation 1 of the embodiment 2 of the present inventionshall be described.

The light bulb shaped lamp according to the variation 1 of theembodiment 2 is different from the light bulb shaped lamp 200 accordingto the embodiment 2 in the method for electrically connecting the twoLED modules 230 and the shape of the end portion of the stem 120. Thefollowing shall describe the light bulb shaped lamp according to thevariation with reference to the drawings. Note that the illustration anddescription for the components identical to the light bulb shaped lamp200 according to the embodiment 2 shall be omitted where appropriate.

FIG. 18 is a plan view of the LED module 230 according to the variation1 of the embodiment 2 of the present invention. FIG. 19 is across-sectional view of a part around the LED module 230 according tothe variation 1 of the embodiment 2 of the present invention in theY-axis direction.

The shape of the end portion of the extended portion 120 a of the stem120 is the projecting shape, in the same manner as the embodiment 2.However, in the variation 1, the cross-section of the end portion of theextended portion 120 a is not circular, but in a rectangle shape. Asdescribed above, since the cross-section of the end portion of theextended portion 120 a is in a polygonal shape, it is possible tosuppress the rotation of the LED module 230 around the axis of theextended portion 120 a (around the Z-axis).

The fixing component 225 is a translucent board component made ofceramic containing aluminum nitride, defining a rectangular through hole226 a. The metal line pattern 228 is formed on the fixing component 225.The LED chips 150 mounted on the base platform 140 in each of the twoLED modules 230 are electrically connected through the metal linepattern 228. The LED modules 230 are electrically connected by the metalline pattern 228 formed on the fixing component 225. Accordingly, it ispossible to electrically connect the LED modules 230 in the globe 110easily.

Note that the line pattern may be formed by a translucent conductivematerial such as indium tin oxide (ITO), instead of the metal linepattern 228 which does not transmit light. In this case, it is possibleto suppress the loss of light emitted by the LED chip 150, compared tothe metal line pattern.

The base platform 140 is a translucent board component made of ceramiccontaining aluminum nitride. Furthermore, the base platform 140 definesthrough holes 242 a and 242 b at both ends in the longer direction(X-axis direction).

The through hole 242 a corresponds to the third through hole. The metalline pattern 143 is formed around the through hole 242 a on the surfaceof the base platform 140. The lead wire 170 is inserted into the throughhole 242 a, and is electrically and physically connected to the metalline pattern 143 by the joining material such as solder. Furthermore,the two through holes 242 a each formed in the one of the two baseplatforms 140 have different axial directions.

As described above, the lead wire 170 is inserted into the through hole242 a defined by the base platform 140. Accordingly, it is possible todisperse the stress exerted on the part connecting the lead wire 170 andthe LED module 230. Accordingly, it is possible to suppress thepossibility that the lead wire 170 is disconnected from the LED module230 by vibration and others.

The through hole 242 b corresponds to the fourth through hole. The metalline pattern 143 is formed around the through hole 242 b on the surfaceof the base platform 140. Furthermore, the conductive component 245 suchas solder is filled in the through hole 242 b. The metal line pattern143 on the base platform 140 and the metal line pattern 228 on thefixing component 225 are electrically connected through the conductivecomponent 245.

The LED chips 150 are mounted on a surface of the base platform 140, asillustrated in FIG. 19. Power is supplied to the LED chips 150 throughthe metal line pattern 143. Note that the line pattern may be formed bya translucent conductive material such as indium tin oxide (ITO),instead of the metal line pattern 143 which does not transmit light.

The LED chip 150 is a semiconductor light-emitting device which emitsviolet light when energized. The sealing material 160 is a translucentcomponent, and is provided to cover the row of LED chips 150. Thesealing material 160 includes blue phosphor, green phosphor, and redphosphor as the wavelength conversion material. Accordingly, the violetlight emitted by the LED chip 150 is converted into white light.

As described above, according to the light bulb shaped lamp according tothe variation 1, the LED modules 230 are electrically connected by themetal line pattern 228 formed on the fixing component 225. Accordingly,it is possible to electrically connect the LED modules 230 easily in theglobe 110.

Variation 2 of Embodiment 2

Next, the variation 2 of the embodiment 2 of the present invention shallbe described.

The light bulb shaped lamp according to the variation 2 of theembodiment 2 of the present invention is characterized in that the leadwire 170 is inserted into the through holes 226 b and 242 b continuouslypenetrating the fixing component 225 and the base platform 140. Thefollowing shall describe the light bulb shaped lamp according to thevariation with reference to the drawings. Note that, the illustrationand description for the components identical to the light bulb shapedlamp according to the embodiment 1 or the variation 1 of the embodiment1 shall be omitted where appropriate.

FIG. 20 is a cross-sectional view of the LED module 230 according to thevariation 2 of the embodiment 2 of the present invention in the Y-axisdirection.

The fixing component 225 defines the through hole 226 b so as tocommunicate with the through hole 242 b formed in the base platform 140.The through hole 226 b corresponds to the second through hole.

Two of the four lead wires 170 are each inserted into the through hole226 b or the through hole 242 b. The two lead wires 170 each insertedinto the through hole 226 b or the through hole 242 b are electricallyand physically connected to the power supply terminals 141 provided atthe base platform 140 by the joining component such as solder.

Note that, the two of the four lead wires 170 are each inserted into thethrough hole 242 a.

As described above, by the light bulb shaped lamp according to thevariation, the lead wire 170 is inserted into the through hole 226 b andthe through hole 242 b passing through the fixing component 225 and thebase platform 140. Accordingly, the fixing component 225 and the baseplatform 140 can be fixed firmly.

Variation 3 of Embodiment 2

Next, the variation 3 of the embodiment 2 of the present invention shallbe described.

The light bulb shaped lamp according to the variation 3 of theembodiment 2 of the present invention is different from the light bulbshaped lamp according to the variation 2 in the shape of the lead wires170. The following shall describe the light bulb shaped lamp accordingto the variation with reference to the drawings. Note that, theillustration and description for the components identical to the lightbulb shaped lamp according to the variation 2 shall be omitted whereappropriate.

FIG. 21 is a cross-sectional view of the LED module 230 according to thevariation 3 of the embodiment 2 of the present invention in the Y-axisdirection.

A rivet 274 is provided at an end of each of the four lead wires 170.The base platform 140 is fixed to the fixing component 225 by the rivet274 inserted into the through holes 226 b and 242 b. Furthermore, thepower supply terminal 141 provided on the base platform 140 iselectrically and physically connected to the lead wire 170 by the rivet274 inserted into the through hole 242 a.

As described above, with the structure of the light bulb shaped lampaccording to the variation, the fixing component 225 and the baseplatform 140 are fixed by the rivet 274 provided at the end of the leadwire 170. Accordingly, it is possible to fix the fixing component 225and the base platform even more firmly. Furthermore, the lead wire 170and the base platform 140 are firmly fixed by the rivet 274.Accordingly, it is possible to suppress the possibility that the leadwire 170 is disconnected from the LED module 230 even more securely.

Variation 4 of Embodiment 2

Next, the variation 4 of the embodiment 2 of the present invention shallbe described.

The light bulb shaped lamp according to the variation 4 of theembodiment 2 is different from the light bulb shaped lamp according tothe embodiment 2 and the variations 1 to 3 of the embodiment 2 in thatfour LED modules 230 are included. The following shall describe thelight bulb shaped lamp according to the variation with reference to thedrawings. Note that, the illustration and description for the componentsidentical to the light bulb shaped lamps according to the embodiment 2and the variations 1 to 3 of the embodiment 1 shall be omitted whereappropriate.

FIG. 22 is a cross-sectional view of a part around the LED module 230according to the variation 4 of the embodiment 2 of the presentinvention. FIG. 23 is a plan view of the LED module 230 according to thevariation 4 of the embodiment 2 of the present invention.

The four LED modules 230 are fixed to the fixing component 225 such thatthe barycenter of the fixing component 225 and the LED modules 230coincides with the center of the through hole 226 a in the longerdirection of the stem 120.

To put it differently, in the variation, the through hole 226 a isformed at the center of the fixing component 225, and the four LEDmodules 230 are identical. Accordingly, the four LED modules 230 areprovided such that the four LED modules 230 are symmetric with respectto the center axis of the through hole 226 a or the extended portion 120a of the stem 120.

The two LED modules 230 are electrically connected to each other throughthe electric wire 244, and current flows as illustrated in the arrow inthe broken line when the light bulb shaped lamp 200 is turned on.

As described above, according to the light bulb shaped lamp according tothe variation, it is possible to hold the four LED modules 230 at aconstant position in the globe 110.

Another Aspect of Variation 4 of Embodiment 2

Next, another aspect of the variation 4 of the embodiment 2 of thepresent invention shall be described.

The light bulb shaped lamp according to the variation 4 of theembodiment 2 of the present invention is different from the light bulbshaped lamp according to the variation 4 in the shape of the fixingcomponent 225. The following shall describe the light bulb shaped lampaccording to the variation with reference to the drawings. Note that,the illustration and description for the components identical to thelight bulb shaped lamp according to the variation 4 shall be omittedwhere appropriate.

FIG. 24 is a plan view of the LED module 230 according to another aspectof the variation 4 of the embodiment 2 of the present invention.

As illustrated in FIG. 24, the fixing component 225 has a cross shape inplan view. The four LED modules 230 are fixed to the fixing component225 such that the longer direction of the LED modules 230 coincides withthe two axial directions of the cross shape (X-axis direction and Y-axisdirection).

As described above, compared to the fixing component 225 in thevariation 4 illustrated in FIG. 23, it is possible to reduce the size ofthe fixing component 225 according to the variation illustrated in FIG.24. Accordingly, it is possible to reduce the possibility that the lightis blocked by the fixing component 225.

The light bulb shaped lamp according to an aspect of the presentinvention has been described based on the embodiment and the variations.However, the present invention is not limited to the embodiments.

For example, in the embodiment, the light bulb shaped lamp 200 receivesAC power from a commercial AC power source. However, the light bulbshaped lamp 200 may receive DC power from a battery cell or others, forexample. In this case, the light bulb shaped lamp 200 does not have toinclude the lighting circuit 180 illustrated in FIG. 6.

In addition, it is not necessary for the stem 120 to have aconfiguration illustrated in the embodiment above. For example, the stem120 may be a rod-shaped component as illustrated in FIG. 25.

FIG. 25 is a cross-sectional view of the light bulb shaped lampaccording to the variation 5 of the embodiment 2 of the presentinvention. In FIG. 25, the stem 120 is a rod-shaped component made ofmetal, ceramic, or glass. One end of the stem 120 is inserted into ahole 122 defined by a surface of a circular board component 121 closingthe opening 111 of the globe 110, and fixed by using adhesive made ofsilicone resin or others. The other end of the stem 120 is inserted intothe through hole 226 a defined by the fixing component 225.

The board component 121 is fit into the opening of the base 190, and acutout 123 is provided at the periphery of the board component 121. Theopening 111 of the globe 100 is inserted into a groove defined by thecutout 123 and the base 190, and the globe 110 is fixed by the adhesive124 made of silicone resin or others. In addition, the board component121 defines a through hole. Each of the lead wires 170 is also insertedinto through hole defined by the board component 121, and is fixed tothe board component 121.

As described above, even if the stem 120 has the configurationillustrated as in FIG. 25, it is possible to support the fixingcomponent 225 to which the LED module 230 is fixed in the globe 110.Accordingly, it is possible to suppress the stress exerted on the partconnecting the lead wire 170 and the LED module 230 when the light bulbshaped lamp 200 is shaken, for example, and to suppress the possibilitythat the lead wire 170 is disconnected from the LED module 230.

Furthermore, the present invention may not only be implemented as thelight bulb shaped lamp, but also as a lighting apparatus including thelight bulb shaped lamp. The following shall describe the lightingapparatus according to an aspect of the present invention with referenceto FIG. 26.

FIG. 26 is a schematic cross-sectional view of the lighting apparatus501 according to the embodiment 2 of the present invention.

The lighting apparatus 501 is used attached to a ceiling 600 in a room,for example, and includes the light bulb shaped lamp 200 according tothe embodiment and a lighting equipment 520 as illustrated in FIG. 26.

The lighting equipment 520 is for turning the light bulb shaped lamp 200on and off, and includes an equipment body 522 attached to the ceiling600 and a lamp cover 522 covering the light bulb shaped lamp 200.

The equipment body 521 includes a socket 521 a. A base 190 of the lightbulb shaped lamp 200 is screwed into the socket 521 a. Power is suppliedto the light bulb shaped lamp 200 through the socket 521 a.

Note that the lighting apparatus 501 described here is an example of thelighting apparatus according to an aspect of the present invention. Thelighting apparatus according to an aspect of the present invention mayinclude at least a socket for holding the light bulb shaped lamp 200 andsupplying power to the light bulb shaped lamp 200. Note that, the base190 does not have to be screwed into the base 190, but may be simplyinserted.

Furthermore, the lighting apparatus 501 illustrated in FIG. 26 includesone light bulb shaped lamp 200. However, the lighting apparatus 501 mayinclude more than one light bulb shaped lamp 200.

Embodiment 3

Next, a light bulb shaped lamp 300 according to the embodiment 3 of thepresent invention shall be described with reference to the drawings.

(Overall Configuration of Light Bulb Shaped Lamp 300)

First, the overall configuration of the light bulb shaped lamp 300according to the embodiment 3 shall be described with reference to FIG.27 to FIG. 29.

FIG. 27 is a perspective view of the light bulb shaped lamp according tothe embodiment 3 of the present invention. FIG. 28 is an explodedperspective view of the light bulb shaped lamp according to theembodiment 3 of the present invention. FIG. 29 is a cross-sectional viewof the light bulb shaped lamp according to the embodiment 3 of thepresent invention.

As illustrated in FIG. 27 to FIG. 29, the light bulb shaped lamp 300according to the embodiment 3 is a light bulb shaped LED lamp replacingan incandescent electric bulb, and includes a translucent globe 110, anLED module 330 which is a light source, a base 190 which receives power,and a stem 340. The light bulb shaped lamp 300 according to theembodiment 3 further includes a supporting component 350, a resin case360, a lead wire 170, and a lighting circuit 180. In the embodiment 3,the light bulb shaped lamp 300 has an envelope composed of the globe110, the resin case 360, and the base 190.

The following shall describe components of the light bulb shaped lamp300 according to the embodiment 3 of the present invention withreference to FIG. 27 to FIG. 29.

(Globe 110)

As illustrated in FIG. 27 to FIG. 29, the globe 110 is a translucentcomponent housing an LED module 330 and transmits the light emitted bythe LED module 330 to outside of the lamp, in the same manner as theembodiment 1. In the embodiment 3, the globe 110 is a hollow componentmade of silica glass transparent to visible light as well. Accordingly,the LED module 330 housed in the globe 110 is visible from outside ofthe globe 110. In the embodiment 3, the shape of the globe 110 is Type A(ES C7710) which is the same as a common incandescent light bulb, thatis, the globe 110 has a shape with one end closed in a spherical shape,and the other end has an opening 111 as well.

(LED Module 330)

The LED module 330 corresponds to a light-emitting module which is alight source of the light bulb shaped lamp 400, and is provided in theglobe 110. It is preferable that the LED module 330 is positioned at thecenter of the spherical shape formed by the globe 110 (for example,inside a large diameter part at which the inner diameter of the globe110 is large). With the LED module 330 positioned at the center, thelight bulb shaped lamp 300 can achieve omnidirectional lightdistribution property when the light bulb shaped lamp 100 is switchedon. The omnidirectional light distribution property is approximated to acommon incandescent light bulb using conventional filament coil.

In addition, the LED module 330 is supported by the two lead wires 170such that the LED module 330 is suspended in the globe 110 (in the largediameter part of the globe 110 in the embodiment 3) and supplied withpower from the lead wires 170. The LED module 330 emits light with thepower supplied from the two lead wires 170. Note that, power supplyterminals are provided at the both ends of the LED module 320, and thepower supply terminal and the lead wire are electrically connected bysolder or others.

Next, the components of the LED module 330 according to the embodiment 3of the present invention shall be described with reference to FIG. 30.FIG. 30 is an enlarged cross-sectional view of a major part of the LEDmodule in the light bulb shaped lamp according to the embodiment 3 ofthe present invention.

As illustrated in FIG. 30, the LED module 330 is a COB light-emittingmodule in which the LED chips are directly mounted on the substrate, andincludes the base platform 140, the LED chips 150, and the sealingmaterial 160, in the same manner as the embodiment 1. The LED module 330is arranged such that the surface on which the LED chips 150 are mountedfacing the top of the globe 110. The following shall describe componentsof the LED module 330 in detail.

(Base Platform 140)

First, the base platform 140 shall be described. Furthermore, the baseplatform 140 is directly fixed to the stem 340. With this structure, theLED module 330 is directly fixed to the stem 340. In the embodiment 3,the base platform 140 is an LED mounting component for mounting the LEDchip 150, and is a component translucent to visible light. In theembodiment 3, a translucent alumina substrate having a transmittance of96% and a rectangle shape with 22 mm in length, 18 mm in width, and 1.0mm in thickness is used.

It is preferable that the base platform 140 is a component having hightransmittance of visible light. With this, the light emitted from theLED chip 150 passes through the inside of the base platform 140, and thelight is emitted from a part on which no LED chip 150 is mounted.Accordingly, even when the LED chips 150 are mounted only on one surfaceof the base platform 140 (front surface), the light bulb shaped lamp 300can achieve omnidirectional light distribution property because thelight is emitted from the other surface (back surface). Theomnidirectional light distribution property is approximated to anincandescent light bulb. Note that, the base platform 140 does not haveto be translucent. Alternatively, the LED chips 150 may be mounted onmore than one surface of the base platform 140.

Note that, it is preferable that the base platform 140 is made of amaterial having a high thermal conductivity and high thermal emissivityin heat radiation so as to increase heat-radiating property, in the samemanner as the embodiment 1. More specifically, the material for the baseplatform 140 is preferably a material referred to as a hard brittlematerial, which is a generic term for glass, ceramic, and others.

(LED Chip 150)

Next, the LED chip 150 shall be described. The LED chip 150 is anexample of the semiconductor light-emitting element, and is a bare chipwhich emits visible light in one color. In this embodiment, a blue LEDchip which emits blue light when energized is used as well. The LEDchips 150 are mounted on one side of the base platform 140. In thisembodiment, one row consists of 12 LED chips 150, and the LED chips 150are mounted in four rows in straight lines. The configuration around theLED chips 150 is identical to FIG. 5. Accordingly, the description shallbe omitted.

Note that, an example in which the LED chips 150 are mounted on the baseplatform 140 has been illustrated. However, the number of the LED chips150 may be changed according to the use of the light bulb shaped lamp300 in the embodiment 3 as well. For example, as a replacement for aminiature light bulb, one LED chip 150 may be mounted on the baseplatform 140. In addition, although the LED chips 150 are mounted on thebase platform 140 in four rows in the embodiment 3. However, the LEDchips 150 may be mounted in one row, or multiple rows other than fourrows.

(Sealing Material 160)

Next, the sealing material 160 shall be described. The sealing material160 is formed in a straight line (stripe) covering the LED chips 150, inthe same manner as the embodiment 1. In this embodiment, four lines ofthe sealing material 160 are formed. The sealing material 160 includes aphosphor which is a material for converting wavelength of light, andalso serves as a wavelength conversion layer which converts thewavelength of light emitted from the LED chip 150. A silicone resin inwhich predetermined phosphor particles (not illustrated) and lightdiffusion material (not illustrated) are dispersed may be used as thesealing material 160. Note that, the details of the sealing material160, such as the material, shape, manufacturing method and others areidentical to the embodiment 1. Accordingly, the description shall beomitted.

(Power Supply Terminal 141)

Next, the power supply terminal 141 shall be described. The power supplyterminal 141 is formed at an end portion of the diagonal part of thebase platform 140. The two lead wires 170 have ends bent in L-shape, andare electrically and physically connected to the power supply terminals141 by solder, respectively.

Note that, although not illustrated, the metal line pattern is formed onthe surface of the base platform 140 where the LEDs are mounted, andeach of the LED chips 150 is electrically connected to the metal linepattern through the wire or others. Power is supplied to the LED chip150 through the metal line pattern. Note that the line pattern may beformed by a translucent conductive material such as indium tin oxide(ITO), instead of the metal line pattern which does not transmit light.

(Base 190)

As illustrated in FIG. 28 and FIG. 29, the base 190 is a power receivingpart for receiving power causing the LED chips 150 in the LED module 330to emit light, and receives AC power from two contacts in the samemanner as the embodiment 1 as well. The power received by the base 190is provided to the power input unit in the lighting circuit 180 throughthe lead wire.

The base 190 is in the type E, and a screw for screwing into a socket ina lighting apparatus is provided at its outer circumferential surface.Furthermore, the screw for screwing into the resin case 360 is formed onthe inner circumferential surface of the base 190. Note that, the base190 is a metal tube having a bottom.

In this embodiment, the base 190 is an E26 base. The light bulb shapedlamp 300 is attached to a socket for E26 base connected to thecommercial AC power source for use.

Note that, the base 190 does not have to be an E26 base, and maybe abase of other size, such as E17. In addition, the base 190 does not haveto be a screw base, and may be a base in a different shape such as aplug-in base.

(Stem 340)

As illustrated in FIG. 28 and FIG. 29, the stem 340 is providedextending from the periphery of the opening 111 of the globe 110 towardthe globe 110. The stem 340 has a rod shape, and has one end configuredto be connected to the LED module 330 and the other end configured to beconnected to the supporting component 350.

The stem 340 is configured of a material having a thermal conductivitylarger than the thermal conductivity of the base platform 140 in the LEDmodule 330. Furthermore, it is preferable for the stem 340 to be made ofa material having a thermal conductivity larger than the thermalconductivity of glass (approximately 1.0 [W/m·K]), and may be composedof an inorganic material such as metal material or ceramics, forexample. In the embodiment 3, the stem 340 is composed of aluminumhaving the thermal conductivity of 237 [W/m·K].

As described above, the stem 340 is composed of a material having athermal conductivity greater than the thermal conductivity of the baseplatform 140. Accordingly, the heat from the LED module 330 isefficiently conducted to the stem 340 through the base platform 140.With this, the heat from the LED module 330 can be transferred towardthe base 190. As a result, it is possible to suppress the reduction inthe light-emission efficacy and in the life of the LED chips 150 due tothe increase in temperature.

In the embodiment 3, the stem 340 includes a first stem part 341 to beconnected to the LED module 330, a second stem part 342 connected to thesupporting component 350, and an intermediate stem part 343 between thefirst stem part 341 and the second stem part 342. The first stem part341, the second stem part 342, and the intermediate stem part 343 areintegrally formed. As described above, the stem 340 according to theembodiment 3 is configured to have a substantially same shape as thestem used for a common incandescent light bulb.

The first stem part 341 is in a cylindrical shape, and has a baseplatform connecting part 341 a to be connected to the base platform 140in the LED module 330. The base platform connecting part 341 a is in adisc shape, and the diameter of the base platform connecting part 341 ais configured to the larger than the diameter of the main body of thefirst stem part 341.

The second stem part 342 is in a shape of disc, and is fixed to thesupporting component 350. With this, the stem 340 is fixed to thesupporting component 350 and supported by the supporting component 350.Furthermore, the diameter of the second stem part 342 is configured tobe larger than the diameter of the first stem part 341.

The intermediate stem part 343 has a small conical trapezoid shapehaving a diameter on the side of the first stem part 341 smaller thanthe diameter on the side of the second stem part 342 and two throughholes for the lead wires 170 to pass through are formed. The lead wire170 is provided through the through hole in the intermediate stem part343, and is connected to the lighting circuit 180 through theintermediate stem part 343 and the second stem part 342. Furthermore, inthe embodiment 3, the lead wire 170 is configured to contact theintermediate stem part 343 and the second stem part 342. With this, theheat from the lead wire 170 can be conducted to the stem 340.

Furthermore, the intermediate stem part 343 has a tilted surfacecomposed of the surface of the conical trapezoidal shape. The tiltedsurface is a reflection surface which reflects the light from the LEDmodule 330 travelling toward the stem 340 (toward the base 190). Stateddifferently, the tilted surface reflects the light transmitted the baseplatform 140 and emitted from the back surface side of the base platform140.

With this, the light travelling toward the base 190 may be reflected ona side opposite to the base 190 or toward the side surface of the lamp,and changes the tilt angle of the tilted surface appropriately so as toadjust the light distribution in a predetermined way for the lightreflected on the tilted surface. Note that, the reflection surface maybe composed by painting the tilt surface white. Alternatively, thereflection surface may be formed using a mirror finish by polishing thesurface or others. Furthermore, by tilting the surface of the supportingmember 350 toward the stem 340 or using a finish achieved by polishingthe surface, it is possible to use the supporting component 350 as areflection surface so as to control the light distribution in apredetermined manner.

As illustrated in FIG. 30, the base platform 140 in the LED module 330abuts and is fixed to the base platform connecting part 341 a in thefirst stem part 341. More specifically, the LED module 330 is supportedby the stem 340.

Furthermore, in the embodiment 3, adhesive material 390 is applied tothe back surface of the base platform 140 so as to cover the baseplatform connecting part 341 a. With this, the first stem part 341 andthe base platform 140 are fixed by the adhesive material 390. Asdescribed above, the base platform 140 and the first stem part 341 arefixed by the adhesive material 390. Accordingly, the LED module 330 isfirmly fixed and held by the stem 340. Note that, the base platform 140contacts the stem 340 in FIG. 30. However, the adhesive material 390 maybe applied between the base platform 140 and the stem 340 as in theembodiment 1.

As the adhesive material 390, an adhesive made of silicone resin may beused, for example. However, an adhesive having a high thermalconductivity is preferably used for efficiently conducting the heat fromthe LED module 330 to the stem 340. For example, the thermalconductivity can be increased by dispersing metal particles in thesilicone resin or others. Note that, the adhesive material 390 may notbe composed entirely of adhesive only. For example, an adhesive materialin a sheet shape on which the adhesive is applied on both surfaces isused, and the adhesive material may be provided between the baseplatform connecting part 341 a in the first stem part 341 and the backsurface of the base platform 140.

Note that, as illustrated in FIG. 29, the stem 340 in the embodiment 3has a solid structure in which the material is filled other than theinsertion holes for the lead wires 170. However, the stem 340 may have ahollow structure having a constant thickness.

(Supporting Component 350)

As illustrated in FIG. 28 and FIG. 29, the supporting component 350 is acomponent connected to the opening end 111 a of the opening 111 in theglobe 110, and supports the stem 340. Furthermore, the supportingcomponent 350 is configured to close the opening 111 of the globe 110.In the embodiment 3, the supporting component 350 is fit into the resincase 360 and fixed.

The stem 350 is configured of a material having a thermal conductivitylarger than the thermal conductivity of the base platform 140 in the LEDmodule 330. Furthermore, it is preferable that the supporting component350 is made of a material having a thermal conductivity larger than thethermal conductivity of glass. For example, the supporting component 350may be made of a metal material or an inorganic material such asceramics. Furthermore, it is preferable that the material for thesupporting component 350 is made of a material having a thermalconductivity equal to or higher than the thermal conductivity of thestem 350 so as to efficiently conduct the heat from the stem 340 to thesupporting component 350. In the embodiment 3, the supporting component350 is made of a material identical to the stem 340. More specifically,the supporting component 350 is composed of aluminum having a thermalconductivity of 237 [W/m·K].

As described above, the supporting component 350 is made of a materialhaving a high thermal conductivity. Accordingly, the heat from the LEDmodule 330 thermally conducted to the stem 340 is efficiently conductedto the supporting component 350. As a result, it is possible to suppressthe reduction in the light-emission efficacy and in the life of the LEDchips 150 due to the increase in temperature.

Furthermore, in the embodiment 3, the supporting component 350 is madeof a disc-shaped board component, and includes a first supporting part351 and a second supporting part 352. In the supporting component 350,the diameter of the second supporting part 352 is configured to belarger than the diameter of the first supporting part 351. With this, astepped part 353 is formed between the periphery of the first supportingpart 351 and the periphery of the second supporting part 352. Note that,the first supporting part 351 and the second supporting part 352 arecollectively formed.

The second stem part 342 in the stem 340 is fixed to the firstsupporting part 351. Furthermore, the inner surface of the resin case360 abuts the side surface of the second supporting part 352. Theopening end 111 a of the opening 111 in the globe 110 abuts the steppedpart 353. Accordingly, the opening 111 in the globe 110 is closed by thesecond supporting part 352. Furthermore, in the stepped part 353, thesupporting component 350, the resin case 360, and the opening end 111 aof the opening 111 in the globe 110 are fixed by the adhesive material391. The adhesive material 391 is formed filling the stepped part 353.

As described above, the supporting component 350 is connected to theglobe 110. Accordingly, the heat from the LED module 330 conducted tothe supporting component 350 is thermally conducted to the globe 110composing the envelope, and is dissipated to the air from the outersurface of the globe 110.

Furthermore, the supporting component 350 is connected to the resin case360 as well. Accordingly, the heat from the LED module 330 conducted tothe supporting component 350 is thermally conducted to the resin case360, and dissipated to the air from the outer surface of the resin case360 composing the envelope.

Note that, when the globe 110 is made of glass as in the embodiment 3,the thermal conductivity of the globe 110 is higher than the thermalconductivity of the resin case 360. In this case, the path fordissipating the heat generated at the LED module 330 is dominantly theformer heat dissipating path (from the stem 340 to the supportingcomponent 350 to the globe 110) which is the heat dissipated from theglobe 110. Accordingly, in this case, the area of globe contacting theoutside air is large, which makes the dissipation even more effective.

Furthermore, as the adhesive material 391 for fixing the globe 110 andothers, the adhesive made of silicone resin may be used, for example.However, it is preferable to use an adhesive material having a highthermal conductivity such that the heat from the LED module 330 isefficiently conducted from the supporting component 350 to the globe 110and the resin case 360. For example, the thermal conductivity can beincreased by dispersing metal particles in the silicone resin or others.

(Resin Case 360)

As illustrated in FIG. 28 and FIG. 29, the resin case 360 is aninsulating case for insulating the stem 340 and the base 190 and forhousing the lighting circuit 180. The resin case 360 is composed of acylindrical first case part 361 and a cylindrical second case part 362.

The inner diameter of the first case part 361 is substantially the sameas the outer diameter of the second supporting part 352 in thesupporting component 350, and the supporting component 350 is fit intothe first case part 361 and fixed. The outer surface of the first casepart 361 is exposed to the outer air. Accordingly, the heat conducted tothe resin case 360 is mostly dissipated from the first case part 361.

The second case part 362 is configured such that the outercircumferential surface contacts the inner circumferential surface ofthe base 190. In the embodiment 3, a screw part for screwing into thebase 190 is formed on the outer circumferential surface of the secondcase part 362, and the second case part 362 contacts the base 190 viathe screw part. Accordingly, the heat conducted to the resin case 360 isconducted to the base 190 through the second case part 362, and isdissipated from the outer surface of the base 190.

In the embodiment 3, the first case part 361 and the second case part362 are collectively formed by the injection molding. The resin case 360is made of polybutylene terephthalate (PBT) containing 5 to 15% of glassfiber and having a thermal conductivity of 0.35 [W/m·K].

(Lead Wire 170)

The two lead wires 170 are electric wires for holding and power supply,and hold the LED module 330 in a constant position in the globe 110, andsupplies power supplied from the base 190 to the LED chip 150.

One of the ends of each of the lead wires 170 is connected to the powersupply terminal 141 in the LED module 330 by solder, and is electricallyconnected to the power supply terminal 141. The other end of each of thelead wires 170 is electrically connected to the power output unit of thelighting circuit 180. Furthermore, each of the lead wires 170 isconfigured to pass through the stem 340 and is in contact with the stem340.

Here, it is preferable that the lead wire 170 is a metal wire includingcopper having high thermal conductivity. With this, the heat generatedat the LED module 330 can be thermally conducted to the stem 340 throughthe lead wire 170.

In addition, it is necessary for the lead wire 170 to be attached to thebase platform 140 as if pressing the base platform 140 toward the stem340. With this, the base platform 140 can be fixed and held by the stem340 even more firmly.

(Lighting Circuit 180)

As illustrated in FIG. 28 and FIG. 29, the lighting circuit 180 is acircuit for causing the LED chip 150 to emit light, and is housed in theresin case 360 in the embodiment 3. More specifically, the lightingcircuit 180 includes a plurality of circuit elements, and a circuitboard on which each of the circuit elements is mounted. In thisembodiment, the lighting circuit 180 converts the AC power received fromthe base 190 to the DC power, and supplies the DC power to the LED chips150 through the two lead wires 170. Note that, the description for thecircuit configuration of the lighting circuit 180 shall be omitted,since the circuit configuration is identical to the configuration inFIG. 6.

Note that, it is not necessary for the light bulb shaped lamp 300 toinclude the lighting circuit 180. For example, the lighting circuit 180is not necessary for the light bulb shaped lamp 300 when the DC power isdirectly supplied from lighting equipment, a battery cell, or others. Inthe embodiment 3, the lighting circuit 180 is not limited to a smoothingcircuit, but may be an appropriate combination of selectedlight-adjusting circuit, voltage booster, and others.

According to the light bulb shaped lamp 300 according to the embodiment3 described above, the LED module 330 is provided in the globe 110 inthe same manner as an incandescent light bulb, and thus the lightemitted by the LED module 330 is not blocked by a metal case.Accordingly, it is possible to achieve the light distributioncharacteristics identical to the conventional incandescent light bulbs.

Furthermore, according to the light bulb shaped lamp 300 according tothe embodiment 3, the base platform 140 in the LED module 330 isconnected to the stem 340 having a thermal conductivity higher than thethermal conductivity of the base platform 140. Accordingly, the heatgenerated at the LED chip 150 in the LED module 330 is efficientlyconducted to the stem 340. Accordingly, the heat at the LED module 330can be efficiently dissipated.

Furthermore, in the embodiment 3, the stem 340 is supported by thesupporting component 350 having a high thermal conductivity.Accordingly, the heat generated at the LED module 330 thermallyconducted to the stem 340 is efficiently conducted to the supportingcomponent 350. The supporting component 350 is connected to the globe110 and the resin case 360 composing the envelope. Accordingly, the heatconducted to the supporting component 350 is dissipated to the airthrough the globe 110 and the resin case 360. As described above, byproviding the supporting component 350, it is possible to furtherimprove the heat radiation property of the LED module 330.

Variation of Embodiment 3

Next, a variation of the light bulb shaped lamp 300 according to theembodiment 3 of the present invention shall be described with referenceto the drawings.

Variation 1 of Embodiment 3

First, the variation 1 of the embodiment 3 of the present inventionshall be described with reference to FIG. 31A and FIG. 31B. FIG. 31A isa perspective view of an LED module and a stem in a light bulb shapedlamp according to the variation 1 of the embodiment 3 of the presentinvention from below. FIG. 31B is a cross-sectional view of the LEDmodule and the stem in the light bulb shaped lamp.

The light bulb shaped lamp according to the variation 1 of theembodiment 3 of the present invention illustrated in FIG. 31A isdifferent from the light bulb shaped lamp 300 according to theembodiment 3 of the present invention illustrated in FIG. 30 in theconfiguration of the base platform in the LED module. Note that, in FIG.31A and FIG. 31B, the components identical to the components illustratedin FIG. 30 are assigned with the same reference numerals, and thedescription for the reference numerals shall be omitted.

As illustrated in FIG. 31A and FIG. 31B, the light bulb shaped lampaccording to the variation 1 of the embodiment 3 of the presentinvention has a recess 325 on the back surface of the base platform 140Xin the LED module 330X. The base connecting part 341 a in the first stempart 341 in the stem 340 is fit into the recess 325 so as to fix thebase platform 140X to the stem 340.

As described above, the light bulb shaped lamp according to thevariation, the base platform connecting part 341 a in the stem 340 isfit into the recess 325 provided on the back surface of the baseplatform 140X. Accordingly, the movement of the base platform 140X isregulated by the stem 340. With this, it is possible to prevent the baseplatform 140X from moving. Accordingly, it is possible fix and hold thebase platform 140X even more firmly.

Furthermore, according to the variation, the base platform 341 a is fitinto the recess 325 in the base platform 140X. Accordingly, it ispossible to increase the area of the stem 340 and the base platform 140Xcontacting each other than in the embodiment 3. With this, it ispossible to dissipate the heat generated at the LED module 330X evenmore efficiently.

Variation 2 of Embodiment 3

Next, the variation 2 of the embodiment 3 of the present invention shallbe described with reference to FIG. 32. FIG. 32 is a cross-sectionalview of the LED module and the stem in the light bulb shaped lampaccording to the variation 2 of the embodiment 3 of the presentinvention.

The light bulb shaped lamp according to the variation 2 of theembodiment 3 of the present invention illustrated in FIG. 32 isdifferent from the light bulb shaped lamp 300 according to theembodiment 3 of the present invention illustrated in FIG. 30 in theconfiguration of the stem. Note that, in FIG. 32, the componentsidentical to the components illustrated in FIG. 30 are assigned with thesame reference numerals, and the description for the reference numeralsshall be omitted.

As illustrated in FIG. 32, in the light bulb shaped lamp according tothe variation 2 in the embodiment 3 of the present invention, the firststem part 341 in the stem 340Y includes a wide base connecting part 341b. More specifically, the base connecting part 341 b in the stem 340Yaccording to the variation is configured to be longer in the longerdirection of the base platform 140 than the base connecting part 341 ain the stem 340 according to the embodiment 3 illustrated in FIG. 30.Note that, the base connecting part 341 b in the stem 340Y according tothis variation is in a rectangular shape in top view.

According to the light bulb shaped lamp described in the variation, thebase connecting part 341 b is configured to be wide. Therefore, it ispossible to increase the area where the stem 340Y and the base platform140 contact with each other than in the embodiment 3. With this, it ispossible to dissipate the heat generated at the LED module 330 even moreefficiently.

Note that, if the length of the base platform 140 in the base platformconnecting part 341 b is L1 and the length of the base platform 140 inthe longer direction is L2, it is preferable that 1.2≦L1/L2≦3.5.

Variation 3 of Embodiment 3

Next, the variation 3 of the embodiment 3 of the present invention shallbe described with reference to FIG. 33A and FIG. 33B. FIG. 33A is aperspective view of an LED module and a stem in a light bulb shaped lampaccording to the variation 3 of the embodiment 3 of the presentinvention. FIG. 33B is a cross-sectional view of the LED module and thestem in the light bulb shaped lamp.

The light bulb shaped lamp according to the variation 3 in theembodiment 3 of the present invention illustrated in FIG. 33A and FIG.33B is different from the light bulb shaped lamp 300 according to theembodiment of the present invention illustrated in FIG. 30 in theconnection between the LED module and the stem. Note that, in FIG. 33Aand FIG. 33B, the components identical to the components illustrated inFIG. 30 are assigned with the same reference numerals, and thedescription for the reference numerals shall be omitted.

As illustrated in FIG. 33A and FIG. 33B, in the light bulb shaped lampaccording to the variation 3 in the embodiment 3 of the presentinvention, the LED module 330 and the stem 340 are fixed by a metalscrew 344 having a screwing part. More specifically, a through hole 140a is provided in the base platform 140 in the LED module 330.Furthermore, a threaded hole 345 having a screw part is provided at thetop of the base platform connecting part 341 a in the first stem part341 in the stem 340. Furthermore, the screw 344 is inserted into thethrough hole 140 a in the base platform 140. Subsequently, the screw 344is screwed into the screw hole 345 in the base platform connecting part341 a. With this, the base platform 140 is fixed to the first stem part341 in the stem 340 by the tightened screw 344.

As described above, according to the light bulb shaped lamp according tothe variation, the base platform 140 in the LED module 330 and the baseplatform connecting part 341 a in the stem 340 are connected by thescrew 344. Accordingly, it is possible to conduct the heat at the LEDmodule 330 to the stem 340 via the screw 344. In this case, the screw344 is present on the side of the base platform 140 where LEDs aremounted. Accordingly, the heat on the side where the LEDs are mountedcan be conducted to the stem 340 efficiently. Furthermore, since thescrew 344 penetrates the base platform 140, it is possible to increasethe area where the base platform 140 and the metal part (the baseplatform connecting part 341 a and the screw 344) than in the embodiment3. As described above, according to the variation, the heat generated atthe LED module 330 can be efficiently conducted to the stem 340.

Furthermore, the base platform 140 in the LED module 330 and the baseplatform connecting part 341 a in the stem 340 are fixed by tighteningthe screw 344. Accordingly, it is possible to fix the LED module 330 tothe stem 340 even more firmly.

Note that, in the variation, it is preferable that the through hole 140a is provided at the center of the base platform 140, and fixed by ascrew at the center of the base platform 140. Since the heat from theLED module 330 tends to remain at the center of the base platform 140,it is possible to further improve the heat radiation property of the LEDmodule 330 by inserting the screw 344 into the through hole 140 a at thecenter of the base platform 140 and fix to the base platform connectingpart 341 a.

Variation 4 of Embodiment 3

Next, the variation 4 of the embodiment 3 of the present invention shallbe described with reference to FIG. 34. FIG. 34 is a cross-sectionalview of the LED module and the stem in the light bulb shaped lampaccording to the variation 4 of the embodiment 3 of the presentinvention.

The light bulb shaped lamp according to the variation 4 in theembodiment 3 of the present invention illustrated in FIG. 34 isdifferent from the light bulb shaped lamp according to the embodiment 3of the present invention illustrated in FIG. 30 in the configuration ofthe stem. Note that, in FIG. 34, the components identical to thecomponents illustrated in FIG. 30 are assigned with the same referencenumerals, and the description for the reference numerals shall beomitted.

As illustrated in FIG. 34, in the light bulb shaped lamp according tothe variation 4 in the embodiment 3 of the present invention, the firststem part 341 in the stem 340 includes a wide base connecting part 341b, in the same manner as the variation 2. More specifically, the baseplatform connecting part 341 b in the stem 340 according to thevariation is configured to be longer in the longer direction of the baseplatform 140 than the base connecting part 341 a in the stem 340according to the embodiment 3 or the variation 3 of the embodiment 3.Note that, the base platform connecting part 341 b in the stem 340according to this variation is in a rectangle shape in top view, in thesame manner as the variation 2.

Furthermore, in the light bulb shaped lamp according to the variation 4,the LED module 330 and the stem 340 are fixed by a metal screw 344having a screw part. More specifically, two through holes 140 a areprovided in the base platform 140 in the LED module 330. Furthermore,two threaded holes 345 each having a screw part are provided at the topof the base platform connecting part 341 b in the first stem part 341 inthe stem 340. Furthermore, the screw 344 is inserted into each of thethrough holes 140 a in the base platform 140. Subsequently, each of thescrews 344 is screwed into each of the screw holes 345 in the baseplatform connecting part 341 b. With this, the base platform 140 isfixed to the first stem part 341 in the stem 340 by the tightened screw344.

According to the light bulb shaped lamp described in the variation, thebase connecting part 341 b is configured to be wide. Therefore, it ispossible to increase the area where the stem 340 and the base platform140 contacts with each other than in the embodiment 3. With this, it ispossible to increase the heat radiation property of the LED module 330further.

Furthermore, according to the light bulb shaped lamp according to thevariation, the base platform 140 in the LED module 330 and the baseplatform connecting part 341 a in the stem 340 are connected by the twoscrews 344. Accordingly, it is possible to conduct the heat at the LEDmodule 330 to the stem 340 via the screw 344 than in the embodiment 3 orthe variation 2 of the embodiment 3. With this, it is possible toincrease the heat radiation property of the LED module 330 further.

Furthermore, the base platform 140 in the LED module 330 and the baseplatform connecting part 341 a in the stem 340 are fixed by tighteningthe two screws 344. Accordingly, it is possible to fix the LED module330 to the stem 340 even more firmly.

Note that, in the variation, it is preferable that the through hole 140a is provided at the center of the base platform 140, and fixed by ascrew at the center of the base platform 140. With this, the heat fromthe LED module 330 which tends to remain at the center of the baseplatform 140 is conducted to the stem 340 through the screw 344; it ispossible to further improve the heat radiation property of the LEDmodule 330.

The light bulb shaped lamp according to an aspect of the presentinvention has been described based on the embodiment and the variations.However, the present invention is not limited to the embodiments and thevariations.

For example, the present invention may not only be implemented as thelight bulb shaped lamp, but also as a lighting apparatus including thelight bulb shaped lamp. The following shall describe the lightingapparatus according to an aspect of the present invention with referenceto FIG. 35. FIG. 35 is a schematic cross-sectional view of the lightingapparatus 502 according to the embodiment 3 of the present invention.

As illustrated in FIG. 35, the lighting apparatus 502 according to theembodiment of the present invention is attached to a ceiling 600 in aroom when in use, and includes a light bulb shaped lamp 300 and alighting equipment 520.

The lighting equipment 520 is for turning the light bulb shaped lamp 300on and off, and includes an equipment body 521 attached to the ceiling600 and a lamp cover 522 covering the light bulb shaped lamp 300.

The equipment body 521 includes a socket 521 a. A base 190 of the lightbulb shaped lamp is screwed into the socket 521 a. Power is supplied tothe light bulb shaped lamp 300 through the socket 521 a.

Note that the lighting apparatus 502 described here is an example of thelighting apparatus according to an aspect of the present invention. Thelighting apparatus according to an aspect of the present invention mayhold the light bulb shaped lamp 300 and includes a socket for supplyingpower to the light bulb shaped lamp 300. Furthermore, the lightingapparatus 502 illustrated in FIG. 35 includes one light bulb shaped lamp300. However, the lighting apparatus 502 may include more than one lightbulb shaped lamp 300.

Furthermore, the LED module 330 is configured using a tabular baseplatform 140. However, it is not limited to this configuration. Forexample, as illustrated in FIG. 36, the LED module 330Z may beconfigured using the quadrangular prism shaped base platform 140Z asdescribed in the embodiment 1. For example, the base platform 140Zhaving a quadrangular prism shape having 20 mm in length, 1 mm in width,and 0.8 mm in thickness may be used. In this case, only one row of LEDs(not illustrated) and the sealing material 160 are formed. As describedabove, having a pillar shaped base platform allows reproducing thefilament coil of incandescent light bulb by using the LED module in asimulative manner. Note that, in the embodiments, the shape and size ofthe base platform are merely examples, and may be in other shape such asa pentagon or octagon, or in a three-dimensional shape by combining morethan one base platform or size.

Furthermore, in the embodiment 3, the supporting component 350 is housedin the resin case 360. However, it is not limited to this example. Forexample, the supporting component 350 may be configured such that a partof the supporting component 350 is exposed to the outside air. Morespecifically, in FIG. 29, it is possible to increase the thickness ofthe second supporting part 352 in the supporting component 350 so as toexpose the side surface of the second supporting part 352.

As described above, by exposing a part of the supporting component 350,the heat at the LED module 330 conducted from the stem 340 to thesupporting component 350 can be dissipated from the part of supportingcomponent 350 being exposed to the outside air (the atmosphere) so as toimprove the heat dissipating property. Furthermore, in this case, theexposed part of the supporting component made of aluminum may beanodized to improve the heat dissipating property.

Furthermore, in the embodiment 3, the LED chips 150 are directly mountedon the base platforms 140, 140X, and 140Z. However, it is not limited tothis configuration. Stated differently, the base platforms 140, 140X,and 140Z are described as components composing the LED module. However,it is not limited to this example. For example, the base platforms 140,140X, and 140Z may be used for the LED module including the LEDsubstrate on which the LEDs are mounted as the base platform formounting the LED module. In this case, it is preferable to compose thebase platform with a material having high light transmittance (forexample, at least 90%).

Embodiment 4

Next, a light bulb shaped lamp 400 according to the embodiment 4 of thepresent invention shall be described with reference to the drawings.

(Overall Configuration of Light Bulb Shaped Lamp 400)

First, the overall configuration of the light bulb shaped lamp 400according to the embodiment 4 shall be described with reference to FIG.37 to FIG. 39.

FIG. 37 is a perspective view of the light bulb shaped lamp according tothe embodiment 4 of the present invention. FIG. 38 is an explodedperspective view of the light bulb shaped lamp according to theembodiment 4 of the present invention. FIG. 39 is a cross-sectional viewof the light bulb shaped lamp according to the embodiment 4 of thepresent invention.

As illustrated in FIG. 37 to FIG. 39, the light bulb shaped lamp 400according to the embodiment 4 is a light bulb shaped LED lamp replacingan incandescent electric bulb, and includes a translucent globe 110, anLED module 430 which is a light source, a base 190 which receives power,and a stem 440. The light bulb shaped lamp 400 according to theembodiment 3 further includes a supporting component 350, a resin case360, a pair of lead wires 170 a and 170 b, and a lighting circuit 180.In the embodiment 4, the light bulb shaped lamp 400 has an envelopecomposed of the globe 110, the resin case 360, and the base 190.

The following shall describe components of the light bulb shaped lamp400 according to the embodiment 4 of the present invention withreference to FIG. 37 to FIG. 39.

(Globe 110)

As illustrated in FIG. 37 to FIG. 39, the globe 110 is a translucenthollow component, houses the LED module 430 inside, and transmits thelight from the LED module 430 to outside of the lamp, in the same manneras the embodiment 1. In the embodiment 1, the globe 110 is a hollowglass bulb made of silica glass transparent to visible light.Accordingly, the LED module 430 housed in the globe 110 is visible fromoutside of the globe 110. In the embodiment 4, the shape of the globe110 is Type A (JIS C7710) which is the same as a common incandescentlight bulb, that is, the globe 110 has a shape with one end closed in aspherical shape, and the other end has an opening 111 as well.

(LED Module 430)

The LED module 430 corresponds to a light-emitting module which is alight source of the light bulb shaped lamp 400, and is provided in theglobe 110. It is preferable that the LED module 430 is suspended in theglobe 110 at the center of the spherical shape formed by the globe 110(for example, inside a large diameter part at which the inner diameterof the globe 110 is large). With the LED module 430 positioned at thecenter, the light bulb shaped lamp 400 can achieve omnidirectional lightdistribution property when the light bulb shaped lamp 100 is switchedon. The omnidirectional light distribution property is approximated to acommon incandescent light bulb using conventional filament coil.

Furthermore, the LED module 430 emits light by receiving the supply ofpredetermined power from the two lead wires 170 a and 170 b. Note that,as illustrated in FIG. 39, the power supply terminals 141 a and 141 bare provided at both ends of the LED module 430, and the power supplyterminals 141 a and 141 b and the lead wires 170 a and 170 b areelectrically connected by the conductive joining component 490 such assolder.

Next, the specific configuration of the LED module 430 according to theembodiment 4 shall be described in detail with reference to FIG. 40A andFIG. 40B. FIG. 40A is a plan view of the LED module in the light bulbshaped lamp according to the embodiment 4 of the present invention. FIG.40B is a cross-sectional view of the LED module along the line A-A′ inFIG. 40A.

As illustrated in FIG. 40A and FIG. 40B, the LED module 430 is a COBlight-emitting module in which the LED chips are directly mounted on thesubstrate, and includes the base platform 140, the LED chips 150, thesealing material 160, the power supply terminals 141 a and 141 b, afirst through hole 425, and second through holes 426. The LED module 430is provided with the surface on which the LED chips 150 are mountedfacing the top of the globe 110. The following shall describe componentsof the LED module 430 in detail.

(Base Platform 140)

First, the base platform 140 shall be described. Furthermore, the baseplatform 140 directly fixed to the stem 440. With this structure, theLED module 430 is directly fixed to the stem 120. Furthermore, in thesame manner as the embodiment 3, the base platform 140 is an LEDmounting board for mounting the LED chips 150, and is a translucentboard translucent to visible light. The base platform 140 in theembodiment 4 is a rectangular board in an elongated rectangle shape.Note that, the shape of the base platform 140 is not limited to arectangular board, but may be a shape of circle or polygons such ashexagon or octagon.

It is preferable that the base platform 140 is a component having hightransmittance of visible light. The blue light emitted by the LED chip150 and the yellow light by the sealing material 160 are transmittedinside the base platform 140 and are emitted from the surface on whichthe LED chip 150 is not mounted. Accordingly, even when the LED chips150 are mounted only on one surface of the base platform 140 (frontsurface), the light bulb shaped lamp 400 can achieve omnidirectionallight distribution property because the light is emitted from the othersurface (back surface). The omnidirectional light distribution propertyis further approximated to an incandescent light bulb. In the embodiment4, a translucent rectangular alumina substrate having a transmittance of96% was used.

Note that, it is preferable that the base platform 140 is made of amaterial having a high thermal conductivity and high thermal emissivityin heat radiation so as to increase heat-radiating property, in the samemanner as the embodiment 3. More specifically, the material for the baseplatform 140 is preferably a material referred to as a hard brittlematerial, which is a generic term for glass, ceramic, and others.

(LED Chip 150)

Next, the LED chip 150 shall be described. The LED chip 150 is anexample of the semiconductor light-emitting element, and is a bare chipwhich emits visible light in one color. In this embodiment, a bluelight-emitting LED chip which emits blue light when energized is used asthe LED chip 150. A plurality of LED chips 150 are mounted on onesurface of the base platform 140, and two rows of LED chips 150 arearranged, each row including 10 LED chips.

Note that, an example in which the LED chips 150 are mounted on the baseplatform 140 has been illustrated in the embodiment 4. However, thenumber of the LED chips 150 may be changed according to the use of thelight bulb shaped lamp 400 in the embodiment 4 as well. For example, asa replacement for a miniature light bulb, one LED chip 150 may bemounted on the base platform 140. In addition, although the LED chips150 are mounted on the base platform 140 in two rows in the embodiment3, the LED chips 150 may be mounted in one row, or multiple rows otherthan two rows.

(Sealing Material 160)

Next, the sealing material 160 shall be described. The sealing material160 is formed in a straight line shape covering the LED chips 150, inthe same manner as the embodiment 1. In this embodiment, two lines ofthe sealing material 160 are formed along the rows of the LED chips 150.The sealing material 160 includes a phosphor which is a material forconverting wavelength of light, and also serves as a wavelengthconversion layer which converts the wavelength of light emitted from theLED chip 150. A phosphor-containing resin in which predeterminedphosphor particles (not illustrated) and light diffusion material (notillustrated) are dispersed may be used as the sealing material 160. Notethat, the details of the sealing material 160, such as the material,shape, manufacturing method and others are identical to theembodiment 1. Accordingly, the description shall be omitted.

(Power Supply Terminal 141 a, 141 b)

Next, the power supply terminals 141 a and 141 b shall be described. Thepower supply terminals 141 a and 141 b are terminal electrodes forreceiving power causing the LED chip 150 to emit light from the leadwires 170 a and 170 b, and the received power is provided to the LEDchip 150. In the embodiment, the power supply terminal 141 a (firstpower supply terminals) is a positive voltage terminal which receivespositive voltage from the lead wire 170 a and supplies positive voltageto one of the electrodes (p-electrode) in the LED chip 150. Furthermore,the power supply terminal 141 b (second power supply terminal) is anegative voltage terminal which receives a supply of negative voltagefrom the lead wire 170 b and supplies a negative voltage to the otherelectrode (n-electrode) on the LED chip 150. With this, the DC power issupplied to each of the LED chips 150.

Furthermore, the power supply terminals 141 a and 141 b are formed onboth ends of the base platform 140 in the longer direction. The secondthrough holes 426 penetrating the base platform 140 are provided on eachof the parts where the power supply terminals 141 a and 141 b areformed. Note that, although not illustrated in FIG. 40A and FIG. 40B, anend of each of the lead wires 170 a and 170 b is inserted into one ofthe second through holes 426. By the conductive joining component 490made of solder, the power supply terminal 141 b and the lead wire 170 aare electrically connected, and the power supply terminal 141 b and thelead wire 170 b are electrically connected.

(First Through Hole 425)

Next, the first through hole 425 shall be described. The first throughhole 425 is provided penetrating the base platform 140, and serves as asecond engaging part engaging with the projection 441 in the stem 440 tobe described later. In the embodiment 4, the first through hole 425 isconfigured for fitting the projection 441 in the stem 440, and the shapeof the first through hole 425 in top view coincides the shape of theprojection 441 in top view. More specifically, the top view of the firstthrough hole 425 is a rectangle which coincides with the base platform140 in the longer direction, and coincides with the shorter direction inthe shorter direction (width direction).

Furthermore, the first through hole 425 is provided substantially at thecenter of the base platform 140. More specifically, the first throughhole 425 is provided at the center of the base platform in the longerdirection and the shorter direction, and is provided between the twolines of sealing material 160 in the embodiment 4.

Note that, the metal line is formed on the surface of the base platform140 on which LEDs are mounted. The metal line is patterned on thesurface of the base platform 140, and electrically connects the LEDchips 150 together with the wire, and electrically connects the LEDchips 150 and the power supply terminals 141 a and 141 b. As the metalline, silver (Ag), tungsten (W), copper (Cu), indium tin oxide (ITO) orothers may be used. Note that, the surface of metal line may be platedby nickel (Ni)/gold (Au) or others.

(Base 190)

As illustrated in FIG. 38 and FIG. 39, the base 190 is a power receivingpart for receiving power causing the LED chips 150 in the LED module 430to emit light, and receives AC power from two contacts in the embodiment4 as well. The power received by the base 190 is provided to the powerinput unit in the lighting circuit 180 through the lead wire.

The base 190 is in the type E, and a screw for screwing into a socket ina lighting apparatus is provided at its outer peripheral surface.Furthermore, the screw for screwing into the resin case 360 is formed onthe inner circumferential surface of the base 190. Note that, the base190 is a metal tube having a bottom.

In this embodiment, the base 190 is an E26 base. The light bulb shapedlamp 400 is attached to a socket for E26 base connected to thecommercial AC power source for use.

Note that, the base 190 does not have to be an E26 base, and maybe abase of other size, such as E17. In addition, the base 190 does not haveto be a screw base, and may be a base in a different shape such as aplug-in base.

(Stem 440)

As illustrated in FIG. 38 and FIG. 39, the stem 440 is a pillar extendedtoward the inside of the globe 110. Stated differently, the stem 440 isprovided extending from the proximity of the opening 111 of the globe110 to the inside of the globe 110.

The stem 440 is a holding component holding the LED module 430. The stem440 in the embodiment 4 is substantially rod-shaped having one endconnected to the LED module 430 and the other end connected to thesupporting component 350. The LED module 430 is on the upper surface ofthe top 440 a of the stem 440. In this embodiment, the LED module 430 isfixed to the stem 440 such that the back surface of the base platform140 abuts the upper surface of the top 440 a. More specifically, the LEDmodule 430 is supported by the stem 440.

As described above, the LED module 430 is suspended in the globe 110 bythe stem 440. More specifically, in the embodiment 4, the base platform140 in the LED module 430 is larger than the top 440 a of the stem 440,and the upper surface of the top 440 a of the stem 440 (a surface onwhich the LED module 430 is placed) is covered by the base platform 140of the LED module 430.

Furthermore, the pillar-shaped stem 440 has a flat part at the top 440 awhere the LED module 430 is to be mounted, and a projection 441protruding the direction in which the stem 440 is extended is provided.The projection 441 is a first engaging part which suppresses therotational movement of the LED module 430 (rotation direction) by beinginserted into the recess or through hole provided in the LED module 430,and serves as a positioning part for positioning the LED module 430 anda rotational prevention part for the LED module 430. More specifically,the movement in the upper surface (the surface on which the LED moduleis mounted) of the LED module 430 placed on the upper surface of the top440 a of the stem 440 is regulated by the projection 441, and theposition of the LED module 430 with respect to the stem 440 isdetermined. In this embodiment, the projection 441 is rectangular in topview, with the longer direction coinciding with the longer direction ofthe base platform 140 and the shorter direction coinciding with thewidth direction of the base platform 140.

As described above, the top view of the projection 441 coincides withthe top view of the first through hole 425 in the base platform 140 inthe LED module 430, and the projection 441 fits into the first throughhole 425. Accordingly, the height of the projection 441 is substantiallyequivalent to the thickness of the base platform 140.

The stem 440 is configured of a material having a thermal conductivitylarger than the thermal conductivity of the base platform 140 in the LEDmodule 430. Furthermore, it is preferable for the stem 440 to be made ofa material having a thermal conductivity larger than the thermalconductivity of glass (approximately 1.0 [W/m·K]), and may be composedof an inorganic material such as metal material or ceramics, forexample. In the embodiment 4, the stem 440 is a metal pillar made ofaluminum having a thermal conductivity of 237 [W/m·K], in the samemanner as the embodiment 3.

As described above, the stem 440 is composed of a material having athermal conductivity greater than the thermal conductivity of the baseplatform 140. Accordingly, the heat from the LED module 430 isefficiently conducted to the stem 440 through the base platform 140.With this, the heat from the LED module 430 can be transferred towardthe base 190 and the globe 110. As a result, it is possible to suppressthe reduction in the light-emission efficacy and in the life of the LEDchips 150 due to the increase in temperature.

Furthermore, in the embodiment 4, the projection 441 is provided in thestem 440. Accordingly, it is possible to increase the area where thebase platform 140 contacts the stem 440 as much as the four sides of theprojection 441. Accordingly, it is possible to conduct the heat at theLED module 430 to the stem 440 even more efficiently, and thus it ispossible to improve the heat dissipating property of the LED module 430.

Note that, if achieving the light distribution property equivalent tothe incandescent light bulb is more important than improving the heatdissipating property of the LED module 430, it is preferable that thestem 440 is made of a transparent component such as glass. However, asdescribed in the embodiment 4, it is possible to achieve the lightdistribution property equivalent to that of incandescent light bulbs.

Furthermore, two insertion holes for inserting the lead wires 170 a and170 b are formed in the large diameter part of the conical trapezoidalshape in the lower part of the stem 440. The lead wires 170 a and 170 bare fixed to the stem 440 through the insertion holes, and one ends ofthe lead wires 170 a and 170 b are electrically connected to the powersupply terminals 141 a and 141 b of the LED module 430, and the otherends are electrically connected to the output unit of the lightingcircuit 180.

Note that, although not illustrated, the base platform 140 in the LEDmodule 430 and the stem 440 are fixed by adhesive. As the adhesive, anadhesive made of silicone resin may be used, for example. However, anadhesive having a high thermal conductivity is preferably used forefficiently conducting the heat from the LED module 430 to the stem 440.For example, the thermal conductivity can be increased by dispersingmetal particles in the silicone resin or others. Note that the adhesiveis not necessarily composed of adhesive only, or be used.

Note that, as illustrated in FIG. 39, the stem 440 in the embodiment 4has a solid structure in which the material is filled other than theinsertion holes for the lead wires 170 a and 170 b. However, the stem340 may have a hollow structure having a constant thickness.

Here, the operation when the LED module 430 is placed on the stem 440shall be described with reference to FIG. 41. FIG. 41 is an enlargedcross-sectional view of a major part of the LED module and the stem inthe light bulb shaped lamp according to the embodiment 4 of the presentinvention. Note that, FIG. 41 illustrates a state in which the powersupply terminal 141 a (141 b) and the lead wire 170 a (170 b) which arenot illustrated are connected by solder yet.

As illustrated in FIG. 41, the LED module 430 is placed on the uppersurface of the top 440 a of the stem 440 such that the projection 441 inthe stem 440 is engaged with the first through hole 425 in the LEDmodule 430. Here, the posture of the LED module 430 is regulated by theprojection 441, and the orientation of the LED module 430 is determinedaccording to the projection 441. As described above, in the embodiment4, the stem 440 and the LED module 430 can be positioned by engaging theprojection 441 into the first through hole 425.

Furthermore, the lead wires 170 a, 170 b and the LED module 430 may bepositioned by engaging the projection 441 into the first through hole425. More specifically, as illustrated in FIG. 41, the lead wires 170 aand 170 b are inserted into the second through hole 426 in the LEDmodule 430 at the same time as engaging the projection 441 into thefirst through hole 425.

(Supporting Component 350)

Returning to the description of FIG. 38 and FIG. 39, the supportingcomponent 350 is a component which is connected to the opening end 111 aof the opening 111 in the globe 110 and supports the stem 440, in thesame manner as the embodiment 3. Furthermore, the supporting component350 is configured to close the opening 111 of the globe 110. Thesupporting component 350 is fit into the resin case 360 and fixed.

The stem 440 is fixed on the upper surface (the surface toward the globe110) of the supporting component 350. The supporting component 350 andthe stem 440 may be fixed by using a screw, for example. Furthermore,the inner surface of the resin case 360 abuts the side surface of thesupporting part 350. Note that, the opening end of the opening 111 ofthe globe 110 abuts the stepped part of the supporting component 350,and the supporting component 350, the resin case 360, and the openingend of the opening 111 of the globe 110 are fixed by adhesive at thestepped part. The adhesive material is formed filling the stepped part.

The supporting component 350 is configured of a material having athermal conductivity larger than the thermal conductivity of the baseplatform 140 in the LED module 430. Furthermore, it is preferable forthe supporting component 350 to be made of a material having a thermalconductivity larger than the thermal conductivity of glass, and may becomposed of an inorganic material such as metal material or ceramics,for example. Furthermore, it is preferable that the material for thesupporting component 350 is made of a material having a thermalconductivity equal to or higher than the thermal conductivity of thestem 440 so as to efficiently conduct the heat from the stem 440 to thesupporting component 350. In the embodiment 4, the supporting component350 is made the same material as the stem 440, that is, aluminum havinga thermal conductivity of 237 [W/m·K].

As described above, the supporting component 350 is made of a materialhaving a high thermal conductivity. Accordingly, the heat from the LEDmodule 430 thermally conducted to the stem 440 is efficiently conductedto the supporting component 350. As described above, the supportingcomponent 350 is connected to the globe 110. Accordingly, the heat fromthe LED module 430 conducted to the supporting component 350 isthermally conducted to the globe 110 composing the envelope, and isdissipated to the air from the outer surface of the globe 110. As aresult, it is possible to suppress the reduction in the light-emissionefficacy and in the life of the LED chips 150 due to the increase intemperature.

Furthermore, the supporting component 350 is connected to the resin case360 as well. Accordingly, the heat from the LED module 430 conducted tothe supporting component 350 is thermally conducted to the resin case360, and dissipated to the air from the outer surface of the resin case360 composing the envelope.

Note that, in the same manner as the embodiment 3, when the globe 110 ismade of glass, the thermal conductivity of the globe 110 is higher thanthe thermal conductivity of the resin case 360. In this case, the pathfor dissipating the heat generated at the LED module 430 is dominantlythe heat dissipating path from the globe 110 (from the stem 440 to thesupporting component 350 to the globe 110). Accordingly, in this case,the area of globe contacting the outside air is large, which makes thedissipation even more effective.

As the adhesive for fixing the supporting component 350, the resin case360, and the globe 110, an adhesive made of silicone resin may be usedin the same manner as the embodiment 3, for example. However, anadhesive having a high thermal conductivity is preferably used forefficiently conducting the heat from the LED module 430 to the globe 110and the resin case 360. For example, the thermal conductivity can beincreased by dispersing metal particles in the silicone resin.

(Resin Case 360)

As illustrated in FIG. 38 and FIG. 39, the resin case 360 is aninsulating case for insulating the stem 440 and the base 190 and forhousing the lighting circuit 180. In the embodiment 4, the resin case360 includes a first case part 361 which is cylindrical and locatedabove and a second case part 362 which is cylindrical and located below.Note that, the configuration of the first case part 361 and the secondcase part 362 is identical to those in the embodiment 3. Accordingly,the description for these components is omitted.

(Lead Wires 170 a, 170 b)

As illustrated in FIG. 37 to FIG. 39, the two lead wires 170 a and 170 bare electric wires for supplying the predetermined DC power to the LEDmodule 430, and supply the DC power supplied from the base 190 to theLED chip 150.

The lead wire 170 a (the first lead wire) is a positive voltagesupplying wire for supplying a positive voltage from the lightingcircuit 180 to the LED module 430. One end of the lead wire 170 a closerto the LED module 430 is electrically connected to the power supplyterminal 141 a by solder, and the other end of the lead wire 170 acloser to the lighting circuit is electrically connected a power outputunit of the lighting circuit 180.

The lead wire 170 b (the second lead wire) is a negative voltagesupplying wire for supplying a negative voltage from the lightingcircuit 180 to the LED module 430. One end of the lead wire 170 b closerto the LED module 430 is electrically connected to the power supplyterminal 141 b by solder, and the other end of the lead wire 170 bcloser to the lighting circuit is electrically connected a power outputunit of the lighting circuit 180.

(Lighting Circuit 180)

As illustrated in FIG. 38 and FIG. 39, the lighting circuit 180 is acircuit for causing the LED chip 150 to emit light, and is housed in theresin case 360 in the same manner as the embodiment 3. Morespecifically, the lighting circuit 180 includes a plurality of circuitelements, and a circuit board on which each of the circuit elements ismounted. In this embodiment, the lighting circuit 180 converts the ACpower received from the base 190 to the DC power, and supplies the DCpower to the LED chips 150 through the two lead wires 170 a and 170 b.Note that, the description for the circuit configuration of the lightingcircuit 180 shall be omitted, since the circuit configuration isidentical to the configuration in FIG. 6.

Note that, it is not necessary for the light bulb shaped lamp 400 tohave the lighting circuit 180, and the light bulb shaped lamp 400 maynot include the lighting circuit 180 if the DC power is directlysupplied from lighting equipment, a battery cell or others. In addition,in the embodiment 4, the lighting circuit 180 may be an appropriatecombination of selected light-adjusting circuit, voltage booster, andothers.

According to the light bulb shaped lamp 400 of the embodiment 4, the LEDmodule 430 is held by the stem 440. The LED module 430 is suspended inthe globe 110 in the same manner as a filament of incandescent lightbulb, and the stem 440 is in a size which is not likely to block thelight from the LED module 430. Accordingly, the light emitted by the LEDmodule 430 is not blocked by a metal case such as the case for theconventional light bulb shaped lamp. Accordingly, it is possible toachieve the light distribution characteristics identical to theconventional incandescent light bulbs.

Furthermore, according to the light bulb shaped lamp 400 of theembodiment 4, a projection 441 is provided in the stem 440 as the firstengaging part, and the first through hole 425 for engaging with theprojection 441 is formed in the base platform 140 in the LED module 430as the second engaging part. With this, it is possible to suppress therotational movement of the LED module 430 having an extending directionof the stem 440 in the LED module 430 as a rotational axis. Accordingly,it is possible to determine the posture of the LED module 430 in adirection of one axis. As a result, the LED module 430 and the stem 440can be easily positioned and the LED module 430 and the lead wires 170 aand 170 b can be positioned easily as well. Accordingly, the lamp can beeasily assembled.

Furthermore, as described in the embodiment 4, it is preferable that thebase platform 140 in the LED module 430 is connected to the stem 440having a thermal conductivity higher than the thermal conductivity ofthe base platform 140. With this, the heat generated at the LED chip 150in the LED module 430 is efficiently conducted to the stem 440.Accordingly, it is possible to efficiently dissipate the heat generatedat the LED module 430.

In this case, the projection 441 is provided at the stem 440, and thusit is possible to increase the area where the stem 440 and the LEDmodule 430 contact each other. With this, it is possible to improve theheat dissipating property of the LED module 430.

Furthermore, as described in the embodiment 4, it is preferable that thestem 440 is supported by the supporting component 350 having a highthermal conductivity. With this, the heat at the LED module 430thermally conducted to the stem 440 is efficiently conducted to thesupporting component 350. The supporting component 350 is connected tothe globe 110 and the resin case 360 composing the envelope.Accordingly, the heat conducted to the supporting component 350 isdissipated to the air through the globe 110 and the resin case 360. Asdescribed above, by providing the supporting component 350, it ispossible to further improve the heat radiation property of the LEDmodule 430.

Note that, in the embodiment 4, the projection 441 and the first throughhole 425 are rectangular in top view. However, it is not limited to thisexample. For example, the projection 441 and the first through hole 425may have a shape of polygon such as triangle, ellipses, non-circularshape or non-square shape.

Furthermore, it is preferable that the top view of the projection 441 isin a shape that determines a shape of the LED module 430 in onepredetermined posture. For example, a shape which is verticallyasymmetric and horizontally asymmetric in top view is preferable.

With this, even if there is one projection 441, it is possible touniquely determine the position of the LED module 430 with respect tothe stem 440 in directions of two axes orthogonal to each other, thatis, in both vertical and horizontal directions in top view. Stateddifferently, the horizontal orientation of the LED module 430 can beuniquely determined. Accordingly, only by engaging the projection 441into the first through hole 425, the lead wire 170 a on the positivevoltage side can be associated with the power supply terminal 141 a onthe positive voltage side, and the lead wire 170 b on the negativevoltage side can be associated with the power supply terminal 141 b onthe negative voltage side. Furthermore, the lead wires 170 a, 170 b andthe LED module 430 may be positioned by engaging the projection 441 intothe first through hole 425.

Variation of Embodiment 4

Next, a variation of the light bulb shaped lamp according to theembodiment 4 of the present invention shall be described with referenceto the drawings. Note that, the overall configuration of the light bulbshaped lamp according to the following variations is identical to theconfiguration illustrated in FIG. 37 to FIG. 39. Accordingly, in thefollowing variation, the description shall be made focusing on thedifference from the embodiment, and the components identical to thecomponents illustrated in FIG. 37 to FIG. 38 are assigned with the samereference numerals, and the description for the components shall beomitted.

Variation 1 of Embodiment 4

First, the variation 1 of the embodiment 4 of the present inventionshall be described with reference to FIG. 42A and FIG. 42B. FIG. 42A isa plan view of the LED module in the light bulb shaped lamp according tothe variation 1 of the embodiment 4 of the present invention, and FIG.42B is a cross-sectional view of the LED module along the line A-A′ inFIG. 42A.

As illustrated in FIG. 42A and FIG. 42B, in the light bulb shaped lampaccording to the variation 1 in the embodiment 4 of the presentinvention, the LED module 430A includes a plurality of the first throughholes 425 and the stem 440A includes a plurality of projections 441.

In this variation, the two first through holes 425 a and 425 b areprovided in one row along the longer direction of the base platform140A. The two first through holes 425 a and 425 b are both in a squareshape in top view.

Furthermore, the stem 440A has two projections 441 a and 441 b forengaging into the two first through holes 425 a and 425 b in one rowalong the longer direction of the base platform 140A. Each of the twoprojections 441 a and 441 b is a square approximately in the same sizeas the first through holes 425 a and 425 b in top view. Note that, thefirst through hole 425 a corresponds to the projection 441 a, and thefirst through hole 425 b corresponds to the projection 441 b.

In this variation, the LED module 430A and the stem 440A are fixed byfitting the projection 441 a into the first through hole 425 a andfitting the projection 441 b into the first through hole 425 b, asillustrated in FIG. 42A and FIG. 42B.

According to the light bulb shaped lamp according to the variation asdescribed above, the LED module 430A and the stem 440A are fixed by theprojections 441 and the through holes 425. Accordingly, even if theshape of the projection 441 and the first through hole 425 in top viewis circular or a regular polygon which does not determine theorientation of the LED module in a direction of one axis by only oneprojection 441 and the first through hole 425, the position of the LEDmodule in the rotation direction can be uniquely fixed by the directionof the arrangement if more than one projection 441 and more than onethrough hole 425 are provided.

Furthermore, the LED module 430A and the stem 440A can be fixed morestably by fixing the projections 441 and the first through hole 425 thanthe embodiment 4 illustrated in FIG. 29. Furthermore, it is possible toincrease the area where the stem 440A contacts the base platform 140A.Accordingly, it is possible to improve the heat dissipating property ofthe LED module 430A compared to the embodiment 4 described above.

Note that, in the variation 1, the projections 441 a and 441 b and thefirst through holes 425 a and 425 b are square-shaped in top view.However, the same effect can be achieved even if the projections arecircular. Furthermore, the variation 1 does not discourage the shape ofthe projections 441 a and 441 b and the first through holes 425 a and425 b in top view to be non-circular, non-square shape such asrectangles. The shape of the projections 441 a and 441 b and the firstthrough holes 425 a and 425 b in top view may be non-circular,non-square shape such as rectangle.

Variation 2 of Embodiment 4

Next, the variation 2 of the embodiment 4 of the present invention shallbe described with reference to FIG. 43A and FIG. 43B. FIG. 43A is a planview of the LED module in the light bulb shaped lamp according to thevariation 2 of the embodiment 4 of the present invention, and FIG. 43Bis a cross-sectional view of the LED module along the line A-A′ in FIG.43A.

As illustrated in FIG. 43A and FIG. 43B, in the light bulb shaped lampaccording to the variation 2 in the embodiment 4 of the presentinvention, the LED module 430B includes the first through hole 425 andthe stem 440A includes a plurality of projections 441.

In the variation, the stem 440A has the same configuration as the stem440A illustrated in FIG. 42A and FIG. 42B, and the stem 440A has twoprojections 441 a and 441 b for engaging into the two first throughholes 425 a and 425 b.

Furthermore, the base platform 140B defines one first through hole 425to which the projections 441 a and 441 b are inserted. Accordingly, thefirst through hole 425 in the variation is rectangular in top view.

In this variation, the LED module 430B and the stem 440A are fixed suchthat the two projections 441 a and 441 b are fit into the first throughhole 425 a, as illustrated in FIG. 43A and FIG. 43B. When the LED module430B and the stem 440A are fixed, there is a gap between the projection441 a and the projection 441 b.

As described above, according to the light bulb shaped lamp according tothe variation, the LED module 430B and the stem 440A are fixed byfitting the plurality of projections 441 into one first through hole425. Accordingly, it is possible to increase the length of the firstthrough hole 425 as much as the width of the plurality of projections441, and thus it is possible to insert the projection 441 into the firstthrough hole 425 more easily than fixing the LED module 430B and thestem 440A by associating one of the first through hole 425 and oneprojection 441. With this, the lamp can be assembled even more easily.

Furthermore, the gap between the projection 441 a and the projection 441b can reduce the stress generated when the projections 441 a and 441 bare inserted into the first through hole 425. With this, it is possibleto increase the acceptable range of the precision in the size of thefirst through hole 425 and the projection 441 than a case in which theLED module 430B and the stem 440A are fixed by associating one firstthrough hole 425 and one projection 441.

Note that, in the embodiment 4, the first through hole 425 isrectangular in top view. However, it is not limited to this example. Thefirst through hole 425 may be in any shape which suppresses the movementin biaxial direction, that is, the arrangement direction of theplurality of projections 441 (441 a, 441 b) and a direction orthogonalto the arrangement direction.

Variation 3 of Embodiment 4

Next, the variation 3 of the embodiment 4 of the present invention shallbe described with reference to FIG. 44A and FIG. 44B. FIG. 44A is a planview of the LED module in the light bulb shaped lamp according to thevariation 3 of the embodiment 4 of the present invention, and FIG. 44Bis a cross-sectional view of the LED module along the line A-A′ in FIG.44A.

As illustrated in FIG. 44A and FIG. 44B, in the light bulb shaped lampaccording to the variation 3 of the embodiment 4 of the presentinvention, the LED module 430C includes a plurality of the first throughholes 425 and the stem 440C includes a plurality of projections 441, inthe same manner as the variation 1.

The variation 3 is different from the variation 1 in the direction wherethe first through holes 425 and the projections 441 are arranged. Morespecifically, in the variation, the base platform 140C defines the twofirst through holes 425 a and 425 b are provided in one row along theshorter direction of the base platform 140C. The two first through holes425 a and 425 b are both in a square shape in top view.

Furthermore, the stem 440C has two projections 441 a and 441 b forengaging into the two first through holes 425 a and 425 b in one rowalong the shorter direction of the base platform 140C. Each of the twoprojections 441 a and 441 b is a square approximately in the same sizeas the first through holes 425 a and 425 b in top view. Note that, thefirst through hole 425 a corresponds to the projection 441 a, and thefirst through hole 425 b corresponds to the projection 441 b.

In this variation, the LED module 430C and the stem 440C are fixed byfitting the projection 441 a into the first through hole 425 a andfitting the projection 441 b into the first through hole 425 a, asillustrated in FIG. 44A and FIG. 44B.

As described above, the light bulb shaped lamp according to thevariation 3 can produce the effect equivalent to the light bulb shapedlamp according to the variation 1.

Note that, the first through hole 425 according to the variation 3 maybe configured like the first through hole 425 according to the variation2.

Variation 4 of Embodiment 4

First, the variation 4 of the embodiment 4 of the present inventionshall be described with reference to FIG. 45A and FIG. 45B. FIG. 45A isa plan view of the LED module in the light bulb shaped lamp according tothe variation 4 of the embodiment 4 of the present invention, and FIG.45B is a cross-sectional view of the LED module along the line A-A′ inFIG. 45A.

As illustrated in FIG. 45A and FIG. 45B, in the light bulb shaped lampaccording to the variation 4 in the embodiment 4 of the presentinvention, the LED module 430D includes a plurality of the first throughholes 425 and the stem 440D includes a plurality of projections 441.

In this variation, the two first through holes 425 a and 425 b which aredifferent in the shape in top view are provided in one row along thelonger direction of the base platform 140D. The first through hole 425 ais a square in top view, and the first through hole 425 b is circular intop view.

Furthermore, the stem 440D has two projections 441 a and 441 b forengaging into the two first through holes 425 a and 425 b havingdifferent shapes in top view are arranged in one row along the longerdirection of the base platform 140D. The projection 441 a (firstprojecting part) is a square approximately in the same size as the firstthrough hole 425 a in top view, and the projection 441 b (secondprojecting part) is a circle approximately in the same size as the firstthrough hole 425 b in top view. Note that, the first through hole 425 acorresponds to the projection 441 a, and the first through hole 425 bcorresponds to the projection 441 b.

In this variation, the LED module 430D and the stem 440D are fixed byfitting the projection 441 a into the first through hole 425 a andfitting the projection 441 b into the first through hole 425 b, asillustrated in FIG. 45A and FIG. 45B.

According to the light bulb shaped lamp according to the variation asdescribed above, the LED module 430D and the stem 440D are fixed by theprojections 441 and the first through holes 425 having different shapesin top view. Accordingly, if the projection 441 and the first throughhole 425 are in a shape such as a square, circle, or rectangle in topview, which does not determine the orientation of the LED in one axialdirection with only one projection 441 and one first through hole 425,it is possible to position the LED module 430D while determining theorientation of the LED module 430D in one axial direction of the LEDmodule 430D.

Stated differently, according to the light bulb shaped lamp in theembodiment 3 and the variations 1 to 3 of the embodiment 3 can fix theLED module while determining the direction of one axis of the LEDmodule. However, with the embodiment 3 and the variations 1 to 3 of theembodiment 3, it was not possible to determine the orientation of theLED module in the direction of one axis.

In contrast, in the light bulb shaped lamp according to the variation,it is possible to determine the posture of the LED module 430D withrespect to the stem 440 can be uniquely determined while determining theorientation of the LED module 430D in the direction of one axis. Stateddifferently, the horizontal orientation of the LED module 430 can beuniquely determined. Accordingly, only by engaging the projections 441 aand 441 b into the first through holes 425 a and 425 b, the lead wire170 a on the positive voltage side can be associated with the powersupply terminal 141 a on the positive voltage side, and the lead wire170 b on the negative voltage side can be associated with the powersupply terminal 141 b on the negative voltage side. More specifically,the lead wires 170 a and 170 b are completely positioned with the LEDmodule 430D at the same time as fitting the projections 441 a and 441 binto the first through holes 425 a and 425 b.

Furthermore, the LED module 430D and the stem 440D are fixed by theprojections 441 and the first through holes 425. Accordingly, the LEDmodule 430D and the stem 440D can be stably fixed; and the heatdissipating property of the LED module 430D can be improved byincreasing the area in which the base platform 140D contacts the stem440D.

Note that, in the variation, the shape of the projections 441 a and 441b and the first through holes 425 a and 425 b in top view are notlimited to the combination described above, and shapes such as a regularpolygon such as rectangle or non-circle such as ellipse or a square maybe appropriately combined.

Variation 5 of Embodiment 4

First, the variation 5 of the embodiment 4 of the present inventionshall be described with reference to FIG. 46A and FIG. 46B. FIG. 46A isa plan view of the LED module in the light bulb shaped lamp according tothe variation 5 of the embodiment 4 of the present invention, and FIG.46B is a cross-sectional view of the LED module along the line A-A′ inFIG. 46A.

As illustrated in FIG. 46A and FIG. 46B, in the light bulb shaped lampaccording to the variation 5 in the embodiment 4 of the presentinvention, the LED module 430E includes a plurality of the first throughholes 425 and the stem 440E includes a plurality of projections 441.

However, in this variation, the two first through holes 425 a and 425 bwhich are in the same shape but in different sizes in top view, that is,in similar shapes are provided in one row along the longer direction ofthe base platform 140E. Although both the first through hole 425 a andthe first through hole 425 b are in a square shape in top view, thelength of one side of the square defining the first through hole 425 ais shorter than the length of one side of the square defined by thefirst through hole 425 b.

Furthermore, the stem 440E has two projections 441 a and 441 b forengaging into the two first through holes 425 a and 425 b in one rowalong the longer direction of the base platform 140E. The projection 441a is a square approximately in the same size as the first through hole425 a in top view, and the projection 441 b is a circle approximately inthe same size as the first through hole 425 b in top view. Note that,the first through hole 425 a corresponds to the projection 441 a, andthe first through hole 425 b corresponds to the projection 441 b.

In this variation, the LED module 430E and the stem 440E are fixed byfitting the projection 441 a into the first through hole 425 a andfitting the projection 441 b into the first through hole 425 b, asillustrated in FIG. 46A and FIG. 46B.

As described above, according to the light bulb shaped lamp according tothe variation, the LED module 430E and the stem 440E are fixed by theprojections 441 and the first through holes 425 in similar shapes and indifferent sizes in top view. With this, in the same manner as the lightbulb shaped lamp according to the variation 4 illustrated in FIG. 45Aand FIG. 45B, the LED module 430E is positioned not only by determiningthe direction of one axis, but also the orientation of the LED module inthe direction of one axis.

Accordingly, only by engaging the projections 441 a and 441 b into thefirst through holes 425 a and 425 b, the lead wire 170 a on the positivevoltage side can be associated with the power supply terminal 141 a onthe positive voltage side, and the lead wire 170 b on the negativevoltage side can be associated with the power supply terminal 141 b onthe negative voltage side. More specifically, the lead wires 170 a and170 b are completely positioned with the LED module 430E at the sametime as fitting the projections 441 a and 441 b into the first throughholes 425 a and 425 b.

Furthermore, the LED module 430E and the stem 440E can be stably fixedby the projections 441 and the first through holes 425. Accordingly, itis possible to improve the heat dissipating property of the LED module430E by increasing the area where the base platform 140 and the stem440E contact each other.

Note that, in the variation 5, the shapes of the projections 441 a and441 b and the first through holes 425 a and 425 b are not limited to theshapes described above, and may be in a non-circular or non-square shapesuch as a regular polygon including a rectangle or ellipse, or may be ashape such as a circular shape which does not determine the orientationof the LED module in the same manner as a square.

Variation 6 of Embodiment 4

First, the variation 6 of the embodiment 4 of the present inventionshall be described with reference to FIG. 47A and FIG. 47B. FIG. 47A isa plan view of the LED module in the light bulb shaped lamp according tothe variation 6 of the embodiment 4 of the present invention, and FIG.47B is a cross-sectional view of the LED module along the line A-A′ inFIG. 47A.

As illustrated in FIG. 47A and FIG. 47B, in the light bulb shaped lampaccording to the variation 6 in the embodiment 4 of the presentinvention, the LED module 430F includes a plurality of the first throughholes 425 and the stem 440F includes a plurality of projections 441.

In this variation, the three first through holes 425 a, 425 b, and 425 care provided alternately along the longer direction of the base platform140F. The three first through holes 425 a, 425 b, and 425 c are all in asquare shape in top view.

Furthermore, in the stem 440F, three projections 441 a, 441 b, and 441 cfor engaging with the three first through holes 425 a, 425 b, and 425 care alternately provided along the longer direction of the base platform140F. The three projections 441 a, 441 b, and 441 c are squaressubstantially in the same size as the first through holes 425 a, 425 b,and 425 c in top view. Note that, the first through hole 425 acorresponds to the projection 441 a, the first through hole 425 bcorresponds to the projection 441 b, and the first through hole 425 ccorresponds to the projection 441 c.

In the variation, the LED module 430F and the stem 440F are fixed byfitting the projection 441 a into the first through hole 425 a, theprojection 441 b into the first through hole 425 b, and the projection441 c into the first through hole 425 c, as illustrated in FIG. 47A andFIG. 47B.

According to the light bulb shaped lamp according to the variation asdescribed above, the LED module 430F and the stem 440F are fixed by theprojections 441 alternately arranged and the first through holes 425alternately arranged. With this, in the same manner as the light bulbshaped lamp according to the variations 4 and 5, the LED module 430F ispositioned not only by determining the one axial direction, but also theorientation of the LED module in the direction of one axis.

Accordingly, only by engaging the projections 441 a, 441 b, and 441 cinto the first through holes 425 a, 425 b, and 425 c, the lead wire 170a on the positive voltage side can be associated with the power supplyterminal 141 a on the positive voltage side, and the lead wire 170 b onthe negative voltage side can be associated with the power supplyterminal 141 b on the negative voltage side. Stated differently, at thesame time as engaging the projections 441 a, 441 b, and 441 c with thefirst through holes 425 a, 425 b, and 425 c, the lead wires 170 a and170 b are positioned with the LED module 430F.

Furthermore, the LED module 430F and the stem 440F are fixed byprojections 441 and the first through holes 425. Accordingly, the LEDmodule 430F and the stem 440F are stably fixed, and the heat dissipatingproperty of the LED module 430F can be improved by increasing the areain which the base platform 140F contacts the stem 440F.

Note that, in this variation, the shape of the projections 441 a, 441 b,and 441 c, and the first through holes 425 a, 425 b, and 425 c are notlimited to a square shape in top view.

Variation 7 of Embodiment 4

Next, the variation 7 of the embodiment 4 of the present invention shallbe described with reference to FIG. 48A and FIG. 48B. FIG. 48A is a planview of the LED module in the light bulb shaped lamp according to thevariation 7 of the embodiment 4 of the present invention, and FIG. 48Bis a cross-sectional view of the LED module along the line A-A′ in FIG.48A.

As illustrated in FIG. 48A and FIG. 48B, in the light bulb shaped lampaccording to the variation 7 of the embodiment 4 in the presentinvention, the LED module 430G does not have a base platform 140Gdefining the first through hole, and a recess 427 is provided on theback surface of the base platform 140G instead. The recess 427 serves asa second engaging part for engaging into the projection 441 in the stem440G, in the same manner as the first through hole. Note that, the shapeof the recess 427 is rectangle when the base platform 140G is viewedfrom the back surface.

Furthermore, the stem 440G includes a projection 441 for engaging withthe recess 427. The projection 441 is a rectangle having anapproximately same size as the recess 427.

In this variation, the LED module 430G and the stem 440G are fixed byfitting the projection 441 into the recess 427, as illustrated in FIG.48A and FIG. 48B.

As described above, according to the light bulb shaped lamp according tothe variation, the same effects as the light bulb shaped lamp accordingto the embodiments described above illustrated in FIG. 37 to FIG. 41 canbe achieved.

Note that the shape of the projection 441 and the recess 427 isrectangular in this variation. However, it is not limited to thisexample. For example, the projection 441 and the recess 427 may have ashape of polygon such as triangle, ellipses, non-circular shape ornon-square shape. Furthermore, the variations 1 to 6 may be applied tothe variation 7.

Variation 8 of Embodiment 4

Next, the variation 8 of the embodiment 4 of the present invention shallbe described with reference to FIG. 49A and FIG. 49B. FIG. 49A is a planview of the LED module in the light bulb shaped lamp according to thevariation 8 of the embodiment 4 of the present invention, and FIG. 49Bis a cross-sectional view of the LED module along the line A-A′ in FIG.49A.

As illustrated in FIG. 49A and FIG. 49B, in the light bulb shaped lampaccording to the variation 8 of the embodiment 4, the base platform 140Hdoes not have the first through hole in the LED module 430H, in the samemanner as the variation 7. Instead, the recess 427 is provided on theback surface of the base platform 140H. The recess 427 functions as asecond engaging part engaging with the top 440 a of the stem 440H, inthe same manner as the variation 7. Note that, the shape of the recess427 is rectangle when the base platform 140H is viewed from the backsurface.

The top 440 a of the stem 440H is a rectangle in top view having anapproximately same size as the recess 427. Note that, in the variation8, the projection 441 is not provided in the stem 440H.

In this variation, the LED module 430H and the stem 440H are fixed byfitting the top 440 a of the stem 440H into the recess 427, asillustrated in FIG. 49A and FIG. 49B.

As described above, according to the light bulb shaped lamp according tothe variation, the same effects as the light bulb shaped lamp accordingto the embodiments described above illustrated in FIG. 37 to FIG. 41 canbe achieved.

Furthermore, according to the variation 8, the LED module 430H ispositioned using the top 440 a of the stem 440H. Accordingly, it is notnecessary to provide the projection 441 separately in the stem 440H.

Note that, in the variation 8, the shape of the top 440 a and the recess427 is not limited to a rectangle, in the same manner as the variation7.

The light bulb shaped lamp according to an aspect of the presentinvention has been described based on the embodiment and the variations.However, the present invention is not limited to the embodiments and thevariations.

For example, the present invention may be implemented as a lightingapparatus including the light bulb shaped lamp. The following shalldescribe the lighting apparatus according to an embodiment of thepresent invention with reference to FIG. 50. FIG. 50 is a schematiccross-sectional view of the lighting apparatus 503 according to theembodiment 4 of the present invention.

As illustrated in FIG. 50, the lighting apparatus 503 according to theembodiment of the present invention is attached to a ceiling 600 in aroom when in use, and includes a light bulb shaped lamp 400 and alighting equipment 520 according to the embodiment of the presentinvention.

The lighting equipment 520 is for turning the light bulb shaped lamp 400on and off, and includes an equipment body 521 attached to the ceiling600 and a lamp cover 522 covering the light bulb shaped lamp 400.

The equipment body 521 includes a socket 521 a. A base 190 of the lightbulb shaped lamp is screwed into the socket 521 a. Power is supplied tothe light bulb shaped lamp 400 through the socket 521 a.

Note that, the lighting apparatus 503 illustrated in FIG. 50 is anexample of the lighting apparatus, and the lighting apparatus accordingto the present invention may at least include a socket for holding thelight bulb shaped lamp 400 and supplying the power to the light bulbshaped lamp 400. Furthermore, the lighting apparatus 503 illustrated inFIG. 50 includes one light bulb shaped lamp 400. However, the lightingapparatus 503 may include more than one light bulb shaped lamp 400.

Furthermore, in the embodiment 4, an LED module in which a phosphor film428 is formed on the upper surface of the base platform (a surface onwhich LEDs are mounted). The LED module 430I according to the variation9 shall be described with reference to FIG. 51A and FIG. 51B. FIG. 51Ais a plan view of the LED module in the light bulb shaped lamp accordingto the variation 9 of the embodiment 4 of the present invention, andFIG. 51B is a cross-sectional view of the LED module along the line A-A′in FIG. 51A.

As illustrated in FIG. 51A and FIG. 51B, the LED module 430I accordingto the variation includes a phosphor film 428 made of the sinteredmaterial film formed approximately on the entire surface of the baseplatform 140. The phosphor film 428 is a wavelength conversion thin filmmade of a sintered material including yellow phosphor particles andglass frit, and is formed in a rectangle shape in the same thickness.

According to the LED module 430I according to the variation, the lighttravelling inside the sealing material 160 among the light emitted bythe LED chip 150, that is, the blue light travelling upward and towardthe sides of the LED chip 150 is excited by yellow phosphor particles inthe sealing material 160, and is converted into yellow light.Accordingly, white light is emitted upward from the base platform 140composed of the yellow light and the blue light.

In contrast, among the light emitted by the LED chip 150, the blue lighttravelling toward the base platform 140, that is, the blue lighttravelling downward from the LED chip 150 is excited by the yellowphosphor particles in the phosphor film 428, and is converted intoyellow light. Accordingly, the white light is emitted from below thebase platform 140, transmitted through the base platform 140.

As described above, according to the LED module 430I of the variation,omnidirectional light distribution property can be achieved since whitelight is emitted omnidirectionally. Therefore, according to the lightbulb shaped LED lamp according to the variation, it is possible toachieve the light distribution property very close to that ofincandescent light bulb.

Note that, in the embodiment 4, the top of the stem and the baseplatform of the LED module are fixed by adhesive. However, it is notlimited to this example. For example, a screw can be used for thefixing.

Furthermore, in the embodiment 4, the base platform is composed of atranslucent board having a translucent property. However, it is notlimited to this example.

Furthermore, in the embodiment 4, the LED chips 150 are mounted only onone surface of the base platform. However, the LED chips 150 may bemounted on multiple surfaces of the base platform.

The light bulb shaped lamp and the lighting apparatus according to thepresent invention have been described based on the embodiments 1 to 4and the variations. However, the present invention is not limited to theembodiments and the variations.

For example, LED was used as an example of the semiconductorlight-emitting device in the embodiments 1 to 4. However, alight-emitting device using semiconductor laser, organic electroluminescence (EL), and inorganic EL may be used.

Those skilled in the art will readily appreciate that many modificationsare possible in the exemplary embodiments without materially departingfrom the novel teachings and advantages of the present invention.Accordingly, all such modifications are intended to be included withinthe scope of the present invention.

INDUSTRIAL APPLICABILITY

The present invention is effective as the light bulb shaped lampreplacing the conventional incandescent light bulbs, particularly alight bulb shaped LED lamp and a lighting apparatus including the lightbulb shaped LED lamp.

REFERENCE SIGNS LIST

-   100, 200, 300, 400 Light bulb shaped lamp-   110 Globe-   111 Opening-   111 a End of opening-   120, 340, 340Y, 440, 440A, 440C, 440D, 440E, 440F, 440G, 440H Stem-   120 a Extended portion-   120 b, 353 Stepped part-   121 Board component-   122 Hole-   123 Cutout-   124, 142, 227, 390, 391 Adhesive material-   130, 230, 330, 330X, 330Z, 430, 430A, 430B, 430C, 430D, 430E, 430F,    430G, 430H, 430I, 1130 LED module-   140, 140X, 140Z, 140A, 140B, 140C, 140D, 140E, 140F, 140G, 140H Base    platform-   140 a, 226 a, 226 b, 242 a, 242 b Through hole-   141, 141 a, 141 b Power supply terminal-   143, 228 Metal line pattern-   144 Recess-   145 Through hole-   150 LED chip-   151 Sapphire board-   152 Nitride semiconductor layer-   153 Cathode-   154 Anode-   155, 156 Wire bonding portion-   157 Gold wire-   158 Chip bonding material-   160 Sealing material-   170, 170 a, 170 b Lead wire-   171 Internal lead wire-   172 Dumet wire-   173 External lead wire-   180, 1180 Lighting circuit-   181 Input terminal-   182 Output terminal-   183 Diode bridge-   184 Capacitor-   185 Resistor-   190, 1190 Base-   191 Screw-   192 Eyelet-   225 Fixing component-   244 Electric wire-   245 Conductive component-   274 Rivet-   325 Recess-   341 First stem portion-   341 a, 341 b Base platform connecting part-   342 Second stem portion-   343 Intermediate stem portion-   344 Screw-   345 Screw hole-   350 Supporting component-   351 First supporting part-   352 Second supporting part-   360 Resin case-   361 First case part-   362 Second case part-   425, 425 a, 425 b, 425 c First through hole-   426 Second through hole-   427 Recessed groove-   428 Phosphor film-   440 a Top-   441, 441 a, 441 b, 441 c Projection-   490 Conductive joining component-   500, 501, 502, 503 Lighting apparatus-   520 Lighting equipment-   521 Equipment body-   521 a Socket-   522 Lamp cover-   600 Ceiling-   1000 Light bulb shaped LED lamp-   1110 Cover-   1200 Outer case-   1210 Peripheral portion-   1220 Light-source attachment-   1230 Recess-   1240 Insulator

1-20. (canceled)
 21. A light bulb shaped lamp comprising: a hollowglobe; a light-emitting module including a base platform and alight-emitting device mounted on the base platform, the light-emittingmodule being provided in the globe; a lead wire for supplying power tothe light-emitting module; and a stem extending toward the interior ofthe globe, the light-emitting module includes a plurality of the baseplatforms and a fixing component for attaching the base platforms, andthe fixing component is directly fixed to the stem.
 22. The light bulbshaped lamp according to claim 21, wherein a first through hole isformed in the fixing component, and an end portion of the stem isinserted into the first through hole.
 23. The light bulb shaped lampaccording to claim 22, wherein a stepped part is formed at the endportion of the stem, and the fixing component is supported by thestepped part formed at the end portion of the stem.
 24. The light bulbshaped lamp according to claim 22, wherein the end portion of the stemis fit into the first through hole.
 25. The light bulb shaped lampaccording to claim 22, wherein the base platforms are fixed to thefixing component such that a barycenter of the fixing component and thebase platforms coincides with a center position of the first throughhole when viewed in a longer direction of the stem.
 26. The light bulbshaped lamp according to claim 21, wherein the fixing component is fixedto an end portion of the stem by an adhesive material.
 27. The lightbulb shaped lamp according to claim 21, wherein a third through hole isformed in the base platform, and the lead wire is inserted into thethird through hole and supports the base platform.
 28. The light bulbshaped lamp according to claim 21, wherein a fourth through hole isformed in the base platform, a second through hole is formed in thefixing component so as to communicate with the fourth through hole, andthe lead wire is inserted into the second through hole and the fourththrough hole.
 29. The light bulb shaped lamp according to claim 28,wherein a conductive rivet is provided at an end of the lead wire, andthe base platform is fixed to the fixing component by the rivet insertedinto the second through hole and the fourth through hole.
 30. The lightbulb shaped lamp according to claim 21, wherein a line pattern is formedon the fixing component, and the light-emitting devices each mounted onone of the base platforms are electrically connected through the linepattern.
 31. The light bulb shaped lamp according to claim 21, whereinthe stem is joined with the globe so as to close an opening of theglobe, and a part of the lead wire is sealed in the stem.
 32. The lightbulb shaped lamp according to claim 21, wherein the fixing component istransparent to visible light.
 33. The light bulb shaped lamp accordingto claim 21, wherein the base platform is translucent.
 34. The lightbulb shaped lamp according to claim 21, wherein the stem is transparentto visible light.
 35. The light bulb shaped lamp according to claim 21,wherein the stem is made of a material having a thermal conductivityhigher than a thermal conductivity of the base platform.
 36. The lightbulb shaped lamp according to claim 21, wherein the globe is made ofglass transparent to visible light.
 37. The light bulb shaped lampaccording to claim 21, further comprising: a base which receives powerfor causing the light-emitting device to emit light; and an insulatingcase which insulates at least the stem and the base, and houses alighting circuit for causing the light-emitting device to emit light.38. A lighting apparatus comprising the light bulb shaped lamp accordingto claim 21.